Micro-resistance seam welding of bulk metallic glasses
Micro-resistance seam welding of bulk metallic glasses
批准号:
21560750
负责人:
FUKUMOTO Shinji
金额:
$3.08万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2009
资助国家:
日本
项目状态:
已结题
起止时间:
2009 至 2011
中文摘要
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英文摘要
Zr based bulk metallic glasses has superior mechanical properties such as high strength and low Young' s modulus. It is necessary to weld metallic glasses to structural alloys to manufacture attractive devices. In the present study, Zr based metallic glass was welded to austenitic stainless steel by micro-resistance spot and seam welding. The microstructural development at the weld interface was investigated, which revealed the welding mechanism. It has been clarified that the weld interfacial structure influenced the weld interfacial strength. Moreover, a novel method considering equipotential surface in the workpieces has been proposed to estimate the current path area at the faying interface.
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Microstructural development at weld interface between Zr-based glassy alloy and stainless steel by resistance microwelding
电阻微焊接锆基非晶合金与不锈钢焊接界面的显微组织发展
DOI:
--
发表时间:
2012
期刊:
Journal of Physics
影响因子:
--
作者:
[S. Fukumoto, M. Minami, A. Soeda, M. Matsushima, M. Takahashi, Y. Yokoyama, K. Fujimoto]
通讯作者:
K. Fujimoto
マイクロ抵抗溶接による金属ガラス/ステンレス鋼接合部の組織制御
微电阻焊金属玻璃/不锈钢接头的微观结构控制
DOI:
--
发表时间:
2010
期刊:
16^<th> Symposium on" Microjoining and Assembly Technology on Electronics"
影响因子:
--
作者:
[福本信次, 南匡彦, 副田輝, 松嶋道也, 横山嘉彦, 藤本公三]
通讯作者:
藤本公三
Resistance micro-seam welding of Zr-based glassy alloys
Zr基非晶合金的电阻微缝焊
DOI:
--
发表时间:
2010
期刊:
影响因子:
--
作者:
[Shinji Fukumoto, Masahiko Minami, Akira Soeda, Yoshihiko Yokoyama, Michiya Matsushima, Kozo Fujimoto]
通讯作者:
Kozo Fujimoto
金属ガラスとステンレス鋼のマイクロ抵抗スポット溶接部の微細組織
金属玻璃与不锈钢微电阻点焊缝的显微组织
DOI:
--
发表时间:
2012
期刊:
18th Symposium on" Microjoining and Assembly Technology on Electronics"
影响因子:
--
作者:
[南匡彦, 福本信次, 副田輝, 高橋誠, 松嶋道也, 横山嘉彦, 藤本公三]
通讯作者:
藤本公三
Zr基金属ガラスとステンレス鋼のマイクロ抵抗シーム溶接
锆基金属玻璃与不锈钢的微电阻缝焊
DOI:
--
发表时间:
2011
期刊:
17th Symposium on" Microjoining and Assembly Technology on Electronics"
影响因子:
--
作者:
[福本信次, 副田輝, 南匡彦, 松嶋道也, 横山嘉彦, 藤本公三]
通讯作者:
藤本公三
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