Development and Application of Heat-resistance Molecular Level Composites with semi-IPN Structure

近年来，聚酰亚胺因其耐热性、电性能和耐用性而广泛应用于绝缘体和胶膜。本文研制了一类由酚醛羟基热塑性芳香族聚酰亚胺和苯并恶嗪组成的新型分子级复合材料，并研究了其组成与各种性能的关系。介绍了聚酰亚胺链基羟基对苯并恶嗪开环聚合的催化作用。分子级复合材料具有柔性和高耐热性。此外，还对复合膜的搭接剪切强度和剥离强度进行了评价，该复合材料具有良好的工业应用粘接性能。

Recently, polyimides have been widely used for insulators and adhesive films because of the heat resistance, electric properties and durability. In this research, new class of molecular level composites composed of an thermoplastic aromatic polyimide with phenolic hydeoxy group and benzoxazines were developed, and relationship between the composition and various properties were studied. The hydroxyl in the polyimide chain group was introduced as catalysis for ring opening polymerization of benzoxazines. The molecular level composites exhibited flexible and high heat resistance. In addition, the lap shear bond strength and peel strength of composite films were evaluated and the composites have good adhesive properties for industrial application.