Dramatic improvement in thermal and electrical properties of copper alloy with nano-structure control

通过纳米结构控制显着改善铜合金的热性能和电性能

• 批准号: 22760558
• 负责人: IMAI Hisashi
• 金额: $ 2.58万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Young Scientists (B)
• 财政年份: 2010
• 资助国家: 日本
• 起止时间: 2010 至 2011
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-22760558/
• 关键词: 粉末冶金; 複合材料; 銅合金; カーボンナノチューブ; 単分散; 熱・電気伝導; 粉末冶金法; 銅粉末; CNT; 熱・電気特性

Characteristics of copper and copper alloy matrix composites reinforced with carbon nanotubes(CNTs) have been investigated. Copper and copper alloy powders coated with un-bundled CNTs were prepared by using the surfactant solution containing CNTs. The extruded Cu-Ti composite alloy containing CNTs revealed small decreased of YS compared to the monolithic Cu-Ti alloy. On the other hand, the composites revealed a higher electrical conductivity than that of the monolithic alloy. For example, Cu-Ti with 0. 19 mass% CNTs showed 175. 8 MPa YS(Pure Cu : 83. 6 MPa) and 83. 5 IACS% conductivity.

研究了碳纳米管（CNTs）增强铜及铜合金基复合材料的性能。采用含碳纳米管的表面活性剂溶液制备了未成束的碳纳米管包覆铜及铜合金粉末。挤压态Cu-Ti复合合金的屈服强度比整体Cu-Ti合金略有降低。另一方面，复合材料显示出比单块合金更高的电导率。例如，Cu-Ti与0. 19质量%的CNT显示175。8 MPa YS（纯铜：83. 6 MPa）和83. 5 IACS%电导率。

项目成果

Ti微量添加銅合金粉末を用いた炭素系ナノ粒子分散複合材料の組織と諸特性

微量Ti铜合金粉碳基纳米粒子分散复合材料的组织与性能

• 发表时间: 2011
• 作者: 今井久志;近藤勝義
• 通讯作者: 近藤勝義