Low Cost and SWAP High Density Packaging for Future RADAR

该项目将为化合物半导体设备开发一种专门的塑料封装能力，包括高密度系统级封装(Sip)设计。这家生产和原型工厂将是独一无二的，专注于针对最具挑战性的材料和操作环境的大功率设备的低重量、低成本和高密度封装。一些需要解决的关键领域包括实现最佳热/机械性能的芯片贴装，以及减轻焊线粘合提升、模具出血和封装分层等问题的定制设计。降低尺寸、重量、功率和成本(SWAP-C)，同时增加复杂性是未来传感器和探测器系统的关键推动因素，该项目最初将针对电子扫描机载雷达系统的发射接收模块，但该技术同样适用于国防和商业应用的其他探测器、传感器和通信系统。Filtronic是英格兰北部从RF到毫米波的组件和子系统的设计和制造商。我们为电信、关键通信、航空航天/国防和太空等市场提供服务。我们是英国和欧洲防务底漆的首选供应商。这一最先进的设施将是对我们现有制造设施的补充，将使英国航空航天和国防工业拥有显著的竞争优势，拥有生产需要高度安全级别的产品的主权能力。

This project will develop a specialist, plastic encapsulation capability for compound semiconductor devices including high density System in Package (SiP) designs. This production and prototyping facility would be unique, focused on low-weight, low-cost high-density packaging for high power devices for the most challenging materials and operational environments. Some key areas to address include die attach for optimal thermal/mechanical performance and custom design to mitigate issues such as wire bond lift, mould bleed and package delamination.Reducing Size Weight Power and Cost (SWAP-C), while simultaneously increasing complexity is a key enabler for future sensor and detector systems, this project will initially target transmit receive modules for electronically scanned airborne radar systems, but the technology is equally applicable to other detector, sensor and communication systems for defence and commercial applications.Filtronic are designers and manufacturers of components and sub-systems from RF to mmWave based in the North of England. We serve markets including Telecommunications, Critical Communications, Aerospace/Defence and Space. We are a preferred supplier to UK and European defence primes. The state-of-the-art facility would be complementary to our existing manufacturing facilities and would give the UK aerospace and defence industry a significant competitive advantage with a sovereign capability for products that require a high level of security.