SUB-WAVELENGTH HOLOGRAPHIC LITHOGRAPHY STEPPER FOR INTEGRATED CIRCUIT PRODUCTION (HoliSTEP)

用于集成电路生产的亚波长全息光刻步进机 (HoliSTEP)

• 批准号: 10102121
• 金额: $ 29.41万
• 依托单位: MODUS RESEARCH AND INNOVATION LIMITED
• 依托单位国家: 英国
• 项目类别: EU-Funded
• 财政年份: 2024
• 资助国家: 英国
• 起止时间: 2024 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=10102121
• 关键词: SUB; WAVELENGTH; HOLOGRAPHIC; LITHOGRAPHY; STEPPER

To achieve ever shrinking dimensions and higher resolutions of circuit elements, projection lithography (PL), is growing in complexity and cost to manufacturers. It is limited to producing 2D images on flat surfaces. Extension to 3D imaging is restricted by trade-off between focus depth and resolution. Advanced, cost-efficient solutions to fabricate wafer-scale 3D components are required. HoLiSTEP unleashes the potential of sub-wavelength Holographic Lithography (HL) as a powerful and enabling disruptive lithography. HL will overcome limitations of PL and facilitate production of novel 3D topographies with high resolution while making the production of high resolution IC much more affordable. An industrial prototype operating at 345nm with 200nm resolution will be produced and validated in an operational environment. Several advancements in holographic stepper subcomponents must be realised: A UV fibre-based laser with 20W output power at 345nm and 1.5m coherence length, an alignment system with 25nm overlay precision, an adaptive optical system with correction precision of 1/20? and software modules for vector diffraction models. Energy consumption of HL technology is drastically reduced compared to PL due to low power-consumption of the laser and production of complex structures in one exposure. HL images are not sensitive to mask defects, eliminating frequent mask replacements and use of toxic materials. Moreover, holographic masks act as projection optics, eliminating the need for complex optical systems. The HL prototype will be verified for 3D patterning for MEMS, MOEMS and micro-optical components to show better resolution, flexibility of 3D printing and reduced cost. HoLiSTEP will empower a positive transformative effect on environment, economy and society by enabling a wider range of companies to produce novel high-resolution 2D and 3D images at lower costs.

为了实现电路元件的不断缩小的尺寸和更高的分辨率，投影光刻（PL）的复杂性和制造商的成本正在增加。它仅限于在平面上生成2D图像。扩展到3D成像受到聚焦深度和分辨率之间的权衡的限制。需要先进的、具有成本效益的解决方案来制造晶圆级3D组件。HoLiSTEP释放了亚波长全息光刻（HL）作为一种强大的颠覆性光刻技术的潜力。HL将克服PL的局限性，促进高分辨率新型3D拓扑的生产，同时使高分辨率IC的生产更加经济实惠。一个在345 nm和200 nm分辨率下工作的工业原型将在操作环境中生产和验证。全息步进机子组件必须实现的几个进步：一个紫外光纤为基础的激光器，输出功率为20 W，在345 nm和1.5米的相干长度，对准系统与25 nm的重叠精度，自适应光学系统的校正精度为1/20？和矢量衍射模型的软件模块。与PL相比，HL技术的能耗大幅降低，这是由于激光器的低功耗和在一次曝光中产生复杂结构。HL图像对掩模缺陷不敏感，避免了频繁更换掩模和使用有毒材料。此外，全息掩模用作投影光学器件，消除了对复杂光学系统的需要。HL原型将用于MEMS，MOEMS和微光学元件的3D图案化，以显示更好的分辨率，3D打印的灵活性和降低的成本。HoLiSTEP将通过使更广泛的公司能够以更低的成本制作新颖的高分辨率2D和3D图像，对环境，经济和社会产生积极的变革性影响。