Intelligent and Efficient Thermal Managed Power Module for Low Carbon Vehicles

适用于低碳汽车的智能高效热管理电源模块

• 批准号: 102287
• 金额: $ 54.53万
• 依托单位: DYNEX SEMICONDUCTOR LIMITED
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2015
• 资助国家: 英国
• 起止时间: 2015 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=102287
• 关键词: Intelligent; Efficient; Thermal; Managed; Power

The advantages brought by Hybrid and Electric Vehicles (HEV/EV) such as being environmentally friendly, less dependent on fossil fuels, cost effective in long term operation etc, HEV/EV has highly focused governments and car manufacturers. Power control is essential in HEV/EV powertrain systems of which the core part is the power IGBT modules. The requirements of modules are strict in electrical and thermal performance, efficiency and reliability. In this project, a power IGBT module incorporating intelligent driver, efficient thermal management concept and advanced packaging technologies for HEV/EV is developed. By combining Dynex Semiconductor's leading expertise in power semiconductors and the University of Nottingham's cutting edge research in enhanced heat transfer and cooling. A new power IGBT module with a flat heat pipe baseplate and intelligent gate driver using advanced bonding and joining technologies such as copper wires, silver sintering and ultrasonic welding will be developed. The module increases heat transfer efficiency by 20% compared with pin fin structures and simplifies cooling system by removing costly, unreliable parts and enhancing efficiency.

混合动力和电动汽车（HEV/EV）带来的优势，如环保，对化石燃料的依赖较少，长期运行成本效益等，HEV/EV受到政府和汽车制造商的高度关注。在HEV/EV动力系统中，功率控制是必不可少的，其核心部分是功率IGBT模块。模块在电气和热工性能、效率和可靠性方面要求严格。本项目为HEV/EV开发了一款融合智能驱动、高效热管理理念和先进封装技术的功率IGBT模块。通过将Dynex半导体在功率半导体方面的领先专业知识与诺丁汉大学在增强传热和冷却方面的前沿研究相结合。将开发一种新型功率IGBT模块，该模块采用扁平热管底板和智能栅极驱动器，采用铜线、银烧结和超声波焊接等先进的键合和连接技术。与针鳍结构相比，该模块的传热效率提高了20%，通过去除昂贵、不可靠的部件和提高效率，简化了冷却系统。