THEIA - Technically high element aligmenent

Theia项目将研究使用III-V族化合物半导体器件在传统低成本硅上组装红外焦平面阵列。该项目是新颖的，因为它的目的是使用传统的商业规格的过程和模具放置设备，而不是定制的高公差机械。通常情况下，它们用于高价值应用，如太空，军事和安全。这些高分辨率成像系统通常使用堆叠到常规硅读出芯片上的III-V族传感器管芯的组合，然后将其放置到混合堆叠中的合适封装中

The Theia project will investigate the assembly of Infrared Focal Plane arrays using group III-V compound semiconductor devices onto conventional lower cost silicon. The project is novel in that it aims to use conventional commercial specification process and die placement equipment rather than bespoke high tolerance machinery. Typically, these are used in high value applications such as space, military and security. These high resolution imaging systems typically use a combination of Group III-V sensor die stacked onto conventional silicon read-out chip and then placed into a suitable package in a hybrid stack