High performance wireless/photonic interfaces for 60 GHz radio over fibre applications

适用于 60 GHz 光纤无线电应用的高性能无线/光子接口

• 批准号: 103443
• 金额: $ 34.39万
• 依托单位: SIVERS PHOTONICS LIMITED
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2018
• 资助国家: 英国
• 起止时间: 2018 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=103443
• 关键词: performance; wireless; photonic; interfaces; 60

In this project, the semiconductor device technology required to achieve multi-gigabit wireless transmission and reception is integrated with the capabilities of semiconductor optical device and fiber networks in order to improve the speed, security, and cost required for point to point communication links. The scheme exploits the recent development of standards and techniques around those frequencies in the millimeter wave spectrum, specifically in the V-band of frequencies. The high data rate possible with this wireless-opto technology (>7Gbps) is several times larger than the data rates currently used in the wireless communications industry. The technology has also additional benefits in terms of immunity from interference, and reduced size of components and antennas. The wireless-opto interface devices in this project share the same platform of compound semiconductor (III-V) material (InP). For the wireless part of the interface, the active component is implemented in the form of a resonant tunnelling diode RTD (oscillator). For the optical part of the interface, the active component is implemented as a high speed distributed feedback (DFB) laser. Both integrated components form the single package wireless-opto transceiver solution.

在该项目中，实现多千兆位无线传输和接收所需的半导体器件技术与半导体光器件和光纤网络的功能相集成，以提高点对点通信链路所需的速度、安全性和成本。该方案利用了毫米波频谱中这些频率（特别是 V 频段）的标准和技术的最新发展。这种无线光电技术可实现的高数据速率 (>7Gbps) 比无线通信行业目前使用的数据速率高几倍。该技术还具有抗干扰性以及减小组件和天线尺寸等额外优势。该项目中的无线光电接口器件共享相同的化合物半导体（III-V）材料（InP）平台。对于接口的无线部分，有源组件以谐振隧道二极管 RTD（振荡器）的形式实现。对于接口的光学部分，有源组件被实现为高速分布式反馈（DFB）激光器。两个集成组件构成了单封装无线光电收发器解决方案。