Low-cost embedded heterogeneous-component manufacturing process for integrated power electronics

我们将通过在功率级别从100S W到100S kW的应用中实现宽带隙开关的真正潜力，展示电子功率转换系统制造的范例转变。电力电子转换器的组装采用低电平电子产品的表面贴装技术和通孔的手动/半自动组装以及更大能量存储和过滤组件的组合。组装过程缓慢&较大部件的几何形状有限，限制了对有限的应用几何形状和可实现的功率密度的适应。我们将通过将电源组件、传感器和控制电子设备嵌入到PCB层压板中来创建这些组件的3D组件，从而实现高功率密度、完整的解决方案，并使用单一制造工艺流程进行复杂的3D内部布线。许多单独的转换器可以在一张卡上制造，因此该工艺既适用于大批量生产，也适用于小批量生产，并且无需重新加工即可重新配置，因此一条生产线可以容纳多种不同的产品。因此，与目前最先进的技术相比，成本可以大幅降低。

We will demonstrate a paradigm shift in the manufacture of electronic power conversion systems by achieving the true potential of wide band-gap switches in applications at power levels from 100s W to 100s kW. Power electronic converters are assembled using a mixture of surface mount technology for low-level electronics & hand/semi-automated assembly of through-hole & larger energy storage & filter components. The assembly processes are slow & the limited range of geometric forms of larger components limits adaption to restricted application geometries & achievable power density. We will create 3D assemblies of power components, sensors & control electronics by embedding these in a PCB laminate allowing power-dense, complete solutions, with complex, 3D internal routing using a single manufacturing process flow. Many individual converters can be made on a single card so the process is suitable for both large & small-volume production & can be reconfigured without re-tooling, so many different products can be accommodated on one production line. Huge reductions in cost over the current state-of-the-art can thus be expected.