Low-cost embedded heterogeneous-component manufacturing process for integrated power electronics

集成电力电子器件的低成本嵌入式异构元件制造工艺

• 批准号: 103535
• 金额: $ 90.84万
• 依托单位: RAM INNOVATIONS LTD
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2017
• 资助国家: 英国
• 起止时间: 2017 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=103535
• 关键词: Low; cost; embedded; heterogeneous; component

We will demonstrate a paradigm shift in the manufacture of electronic power conversion systems by achieving the true potential of wide band-gap switches in applications at power levels from 100s W to 100s kW. Power electronic converters are assembled using a mixture of surface mount technology for low-level electronics & hand/semi-automated assembly of through-hole & larger energy storage & filter components. The assembly processes are slow & the limited range of geometric forms of larger components limits adaption to restricted application geometries & achievable power density. We will create 3D assemblies of power components, sensors & control electronics by embedding these in a PCB laminate allowing power-dense, complete solutions, with complex, 3D internal routing using a single manufacturing process flow. Many individual converters can be made on a single card so the process is suitable for both large & small-volume production & can be reconfigured without re-tooling, so many different products can be accommodated on one production line. Huge reductions in cost over the current state-of-the-art can thus be expected.

我们将展示电子电源转换系统制造的范式转变，实现功率水平从100瓦到100千瓦的宽带隙开关的真正潜力。电力电子转换器的组装使用低水平电子器件的表面贴装技术和通孔、更大的储能和滤波器组件的手动/半自动组装。组装过程缓慢，较大组件的几何形状范围有限，限制了对限制应用几何形状和可实现功率密度的适应。我们将通过将其嵌入PCB层压板中来创建功率组件，传感器和控制电子设备的3D组件，从而实现功率密集，完整的解决方案，并使用单一制造工艺流程实现复杂的3D内部路由。许多单独的转换器可以在一张卡上制造，因此该工艺适用于大批量和小批量生产，并且可以在不重新加工的情况下重新配置，因此一条生产线可以容纳许多不同的产品。因此，与目前最先进的技术相比，可以预期成本将大幅降低。