Low-cost embedded heterogeneous-component manufacturing process for integrated power electronics

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We will demonstrate a paradigm shift in the manufacture of electronic power conversion systems by achieving the true potential of wide band-gap switches in applications at power levels from 100s W to 100s kW. Power electronic converters are assembled using a mixture of surface mount technology for low-level electronics & hand/semi-automated assembly of through-hole & larger energy storage & filter components. The assembly processes are slow & the limited range of geometric forms of larger components limits adaption to restricted application geometries & achievable power density. We will create 3D assemblies of power components, sensors & control electronics by embedding these in a PCB laminate allowing power-dense, complete solutions, with complex, 3D internal routing using a single manufacturing process flow. Many individual converters can be made on a single card so the process is suitable for both large & small-volume production & can be reconfigured without re-tooling, so many different products can be accommodated on one production line. Huge reductions in cost over the current state-of-the-art can thus be expected.