High temperature corrosion protection of graphite parts for semiconductor industry

“下一代电子设备，尤其是电力设备，是在各种材料的晶圆上制造的。半导体工业开始在非常高的温度（高达1800摄氏度）下加工晶圆。支持晶圆的材料（即碳化硅涂层石墨）在1500℃时达到了其温度极限，需要引入能够满足这些半导体工艺中使用的高温和其他要求的新材料。热边缘涂层旨在开发在石墨上沉积耐高温材料的新技术，以保护石墨在半导体工业中的应用免受腐蚀。”

"Next generation electronic devices, and especially power devices, are made on wafers a variety of materials. The semiconductor industry starts to process wafers at very high temperature (up to 1800 C). Materials to support the wafers (i.e. silicon carbide coated graphite) have reached their temperature limits at 1500 C. New materials need to be introduced which can fulfill the high temperature and other requirements used in those semiconductor processes.Thermic Edge Coatings aims to develop new technology for deposition of high temperature resistant materials on graphite in order to protect it against corrosion in semiconductor industry applications."