(LAND) Laser drilling guideplAtes for semicoNDuctor wafer test

LAND将开发用于下一代器件的陶瓷部件的超高精度激光钻孔。高孔数陶瓷板需要超过60,000个激光钻孔，每个最终设备需要几个板。自2001年以来，牛津激光（OL）一直是世界领先的陶瓷钻孔技术供应商，在主要工业供应链中发挥着至关重要的作用。每年设备都变得越来越小，技术上的挑战是在越来越紧的球场上钻越来越小的洞。该项目将开发新的硬件原型和先进的激光钻井配方，以提高当前的技术水平，并展示更小的孔尺寸、更高的纵横比和更快的产量。该项目将把TRL级别从3级提升至6级。牛津激光公司将以该领域的现有专业知识为基础，将我们的研发团队和专用硬件部署到29年激光钻孔经验的项目中。我们希望该项目能够使牛津激光公司继续在关键的、快速增长的出口市场中占据主导地位，并在机械钻井作为一种竞争解决方案迅速萎缩的情况下增加市场份额。关键词：陶瓷激光打孔，半导体晶圆测试，Probecard

LAND will develop ultra-high precision laser drilling in ceramic components for next generation devices. High hole count ceramic plates are required with more than 60,000 laser drilled holes per plate with several plates needed per final device. Oxford Lasers (OL) has been a world-leading supplier of the ceramic drilling technology since 2001 and plays a critically important role in major industrial supply chains.Each year devices get smaller and the technical challenge is to drill ever smaller holes on ever tighter pitches. The project will develop new hardware prototypes and advanced laser drilling recipes to progress current state of art and demonstrate reduced hole size, increased aspect ratio and faster production rates. The project will lift developments from TRL level 3 to 6\.Oxford Lasers will build on existing expertise in this field and deploy our R&D team and dedicated hardware to the project building on 29 years laser drilling experience. We expect this project to enable Oxford Lasers to continue its dominant presence in critical, rapidly growing export markets and increase market share as mechanical drilling is fast dwindling as a competing solution.Keywords: ceramic laser drilling, semiconductor wafer test, Probecard