Particle Impact Deposition for the Manufacture of Next Generation Electroceramics

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Particle impact deposition (AD) is a new solid-state coating technique by which fine particles are accelerated to high velocities by a supersonic gas jet and impacted onto a substrate to build up a thin functional wafer/film. The impact velocity needs to exceed a material- and process-dependent critical velocity to deform particles and adhere them to the substrate. The produced film has applications in micro-actuators and components in sensors, thermoelectric generators, superconductors, fuel cells, batteries and magnetic materials. The technique offers advantages over traditional thermal spray techniques, e.g. stability for the deposition of oxygen/temperature-sensitive materials. However, the efficiency of impingement and retention is low and the conditions for attaining desirable film properties are not well-understood, limiting the development of the technique. In this project, a combined modelling and experimental work on the impact dynamics of micrometre-sized particles is planned. The aim is to obtain a better understanding of the mechanisms of particle impact and film formation during the deposition process by modelling of particle impact and deformation and experimental work for validation. The project outcome will help identify, control and modify the factors (material and/or process-related) that adversely affect the efficiency of the deposition process and quality of the produced films. This contributes to the enhancement of the latter two, which in turn can lead to the more widespread industrial use of the technique.