Development of a Miniature Refrigeration System for Electronics Cooling

该应用程序用于由三个在传热学、系统模拟和部件设计方面拥有专业知识的团队对具有重大工业和社会意义的冷却领域进行合作研究。领导团队将与牛津大学和南岸大学的支持团队一起驻扎在纽卡斯尔大学。如果电子芯片的性能遵循当前的趋势，每18个月翻一番(摩尔定律)，那么很快就不可能使用传统的被动冷却来有效地冷却它们，必须找到替代技术/设备。这项提议涉及到开发这样一种设备。特别是，它涉及对微型蒸汽压缩制冷循环的理论分析和实验评估，该循环针对未来电子系统的冷却进行了优化。拟议的工作将由三个不同但相互关联的活动组成，这些活动将由具有公认的技能、专门知识、资源和经验的人员在三个中心开展，以开展这项工作。拟议的工作具有创新性，因为它将审查迄今尚未研究过的与微型制冷系统有关的问题。它的目的是探索与系统稳定性相关的设计标准，并开发设计代码，以帮助此类系统的设计者和制造商。多孔材料中相变的换热性能以及与压缩机开发相关的技术转让都有助于使该项目成为一个非常创新的项目。这些小组已经有了合作的经验，并将作出安排，促进在更大范围内交流想法和专业知识。与三个相互独立的项目相比，综合办法将提供重大优势，并在电子冷却技术方面向前迈进一大步。这项工作将得到几个行业合作伙伴和合作者的支持，即Thermacore、Panasonic和Honeywell，他们都将为该项目提供技术和实物资源。已获得松下、Thermacore、霍尼韦尔-Hymatic和Hexag的支持函。

This application is for collaborative research on an area of cooling of great industrial and social significance by three teams with expertise in heat transfer, system simulation and component design. The lead team will be based at Newcastle University with the support teams at Oxford and South Bank UniversitiesIf the performance of electronic chips follow current trends and double every 18 months (Moore's Law), then it will soon not be possible to effectively cool them using conventional passive cooling and an alternative technique/devices must be found. This proposal is concerned with developing such a device. In particular it is concerned with a theoretical analysis and experimental evaluation of a miniature vapour compression refrigeration cycle optimised for the cooling of future electronic systems. The proposed work will consist of three distinct but interrelated activities that will be conducted at three centres by personnel with recognised skills, expertise, resources and experience to undertake this work. The proposed work is innovative in that it will examine issues associated with miniature refrigeration systems that have not been studied hitherto. It is intended to explore design criteria related to system stability and develop design codes to assist designers and manufacturers of such systems. The heat transfer performance of phase change in porous materials and the technology transfer associated with the compressor development all contribute to making this a very innovative project. The groups already have experience of working together and arrangements will be put in place to facilitate the exchange of ideas and expertise on a larger scale. The integrated approach will provide significant advantages compared to three unlinked projects and produce a significant step forward in electronic cooling technology. The work will be supported by several industrial partners and collaborators namely Thermacore, Panasonic and Honeywell who will all contribute technical and in kind resources to the project. Letters of support have been obtained from Panasonic, Thermacore, Honeywell-Hymatic and Hexag.