Metallization and three dimensional packaging for MEMS applications

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Micro-electro-mechanical systems or MEMS typically involve the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, such as a wafer, through the utilization of micro-fabrication techniques. MEMS are envisaged to revolutionize nearly every micro-device product category by bringing together silicon-based microelectronics with micromachining technologies. In this way, MEMS make possible the realization of the concept of complete ystems-on-a-chip. As a result, the commercial potential of MEMS devices is practically boundless in the current marketplace. Packaging of MEMS devices is a crucial processing step. MEMS devices are delicate structures, so that in addition to providing electrical interconnection, the package often needs to provide mechanical and environmental protection. Many MEMS packages are device specific, which can be costly, accounting for up to 90% of the system costs. One way of reducing costs is through the use of wafer-level packaging. In this method, the MEMS devices, which are fabricated on a wafer, are bonded directly to a capping wafer prior to sectioning of the wafer into individual devices. Wafer-level MEMS packaging can provide hermetic protection or provide controlled media access. Micralyne is a leading Canadian MEMS foundry, and needs to reduce production costs as a way to remain competitive, both nationally and globally, and to increase their market share.