A study of boiling heat transfer mechanisms in micro-fluidic systems

由于今天的电子元件被要求以更快的速度执行任务，高功率集成电路已经被生产出来，以满足这一需求。这些高速电路预计会产生热流，导致电路超过其允许的温度。微通道传热控制着微通道散热器的性能，这是一项最新技术，旨在管理当今高端电子产品的严格热要求。微散热器也有许多工业应用，包括微冷却装置，高转换核反应堆，化学处理，微流体装置，以及芯片上的微型发电厂。本研究的主要目的是研究影响微型散热器性能的传热和流体流动现象。本研究的重点是：1 .基于实验建立微通道内流动和传热现象的物理模型；2-研究临界热通量对散热器稳定运行的影响；3-模拟沸腾传热机制和导致干燥现象的机制；开发无源平面微混合器，用于完整的微流体系统，如微冷却系统或作为独立设备。提出的研究应该产生相当大的见解，先进的和创新的微热装置的设计，没有在公开的文献。这项研究的成果将用于小型电子产品的热管理，并将导致芯片上的发电厂的发展，这将扩大便携式电子产品、机器人和小型车辆的市场。它还将产生关于与微系统有关的传热和流体流动的新基本知识，这些知识将发表在公开文献中，并将有助于培训高素质的人员。

As today's electronic components are required to perform tasks at a faster rate, high-powered integrated circuits have been produced in order to meet this need. These high-speed circuits are expected to generate heat fluxes that will cause the circuit to exceed its allowable temperature. Microchannel heat transfer governs the performance of the microchannel heat sink, which is a recent technology aimed at managing the stringent thermal requirements of today's high-end electronics. Micro-heat sinks also have many industrial applications including micro-cooling devices, high conversion nuclear reactors, chemical processing, micro-fluidic devices, as well as micro-power-plants-on-chips. The principal objective of this research is to investigate the heat transfer and fluid flow phenomena affecting the performance of micro heat sinks. This proposal focuses particularly on: 1- developing physics-based models based on experiments for the flow and heat transfer phenomena in microchannels; 2- investigating the effect of critical heat flux on the stable operation of heat sinks; 3- modeling the mechanisms of boiling heat transfer and those leading to dry out phenomena; 4- developing passive planar micromixers, to be either implemented in a complete microfluidic system, such as a micro cooling system or as a stand-alone device. The proposed research should yield considerable insight into advanced and innovative designs of micro heat devices not available in the open literature. The outcome of the proposed research will be used in the thermal management of compact electronics, and will lead to the development of power-plants-on-chips, which will broaden the market of portable electronics, robotics, and small vehicles. It will also result in the generation of new basic knowledge regarding heat transfer and fluid flow related to microsystems, which will be published in the open literature, and will assist in training highly qualified personnel.