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Design Automation for Complex Microsystems

Design Automation for Complex Microsystems
复杂微系统的设计自动化
批准号:
261517-2012
负责人:
Khazaka, Roni
金额:
$1.31万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2016
资助国家:
加拿大
项目状态:
已结题
起止时间:
2016-01-01 至 2017-12-31

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中文摘要
翻译
电子设计自动化(EDA)和计算机辅助设计(CAD)工具是使微电子行业在全球范围内蓬勃发展成为一个价值数十亿美元的行业的关键推动因素,加拿大处于这场革命的前沿。CAD工具使设计者能够管理包含数百万个晶体管的超大规模设计的复杂性,并显著降低设计成本和上市时间。因此,微电子行业是一个价值数十亿美元的行业,对大多数消费产品都有影响。最近,光刻技术的进步已经导致了更小的器件尺寸进入纳米范围。封装技术正在以非常快的速度发展,以解决集成、信号完整性和功率分配问题,基于纳米技术、微型机电系统(MEMS)、光电子学技术和生物/化学传感器的新技术和器件正在与微电子技术相集成,以形成具有广泛潜在应用的微系统,从游戏到生物医学应用。虽然这些技术进步对经济增长和改善加拿大人的生活来说是一个重要的机会,但它们也导致设计的复杂性显著增加。该研究计划的目的是开发先进的模拟算法和方法,并利用处理器体系结构方面的最新进展,以解决先进微系统设计日益复杂的问题。这种高效的自动化设计工具对于这个行业的持续发展是必要的。
英文摘要
Electronic design automation (EDA) and computer aided design (CAD) tools were the key enabler that allowed the microelectronics industry to flourish into a multi-billion dollar industry world wide, with Canada at the forefront of this revolution. CAD tools have allowed designers to manage the complexity of very large scale designs containing millions of transistors, and to significantly reduce the design cost and time to market. As a result, the microelectronics industry is a multi-billion dollar industry with impact on most consumer products. Recently, advances in lithography have lead to smaller device sizes well into the nanometer range. Packaging technology is advancing at a very fast pace in order to address integration, signal integrity and power distribution issues, and novel technologies and devices based on nanotechnology, micro-electro-mechanical systems (MEMS), opto-electronics technologies and bio/chemical sensors are being integrated with microelectronics in order to form Microsystems with wide ranging potential applications ranging from games to biomedical applications. While these technological advances represent an important opportunity for economic growth, and for improving the lives of Canadians, they also result in a significant increase in the complexity of design. The aim of this research program is to develop advanced simulation algorithms and methodologies, and leverage recent advances in processor architecture in order to address the increasing complexity of advanced Microsystems design. Such efficient automated design tools are necessary for the continued growth of this industry.
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Simulation, Modeling and Design Automation for High-Performance Chip, Package and Systems
  • 批准号:
    RGPIN-2020-06095
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.4万
  • 财政年份:
    2022
  • 负责人:
    Khazaka, Roni
  • 依托单位:
Simulation, Modeling and Design Automation for High-Performance Chip, Package and Systems
  • 批准号:
    RGPIN-2020-06095
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.4万
  • 财政年份:
    2021
  • 负责人:
    Khazaka, Roni
  • 依托单位:
Simulation, Modeling and Design Automation for High-Performance Chip, Package and Systems
  • 批准号:
    RGPIN-2020-06095
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.4万
  • 财政年份:
    2020
  • 负责人:
    Khazaka, Roni
  • 依托单位:
Design Automation for Complex Microsystems
  • 批准号:
    261517-2012
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $1.31万
  • 财政年份:
    2015
  • 负责人:
    Khazaka, Roni
  • 依托单位:
海外基金