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Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics

Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
用于柔性电子产品的铜-石墨烯复合结构的直接激光图案化
批准号:
RGPIN-2020-04167
负责人:
Peng, Peng
金额:
$2.77万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2021
资助国家:
加拿大
项目状态:
已结题
起止时间:
2021-01-01 至 2022-12-31

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中文摘要
翻译
该研究计划将通过深入了解激光加工条件与铜纳米颗粒和/或铜-石墨烯结的界面结构之间的关系,以及复合结构的电学/热学性能和最终的原型柔性电子性能之间的关系,重点研究在各种电子应用基板上快速制造铜-石墨烯(Cu-Gr)复合结构的直接激光写入工艺。本研究的三个目标是:(i)开发一种一步直接写入工艺,用于在各种衬底上快速制作Cu-Gr复合材料的图案化;(ii)研究激光致热、Cu纳米颗粒形成和连接、聚合物快速热解和Gr结构生长过程,特别是将激光致热与Cu- Cu和Cu- Gr界面缺陷及其电导率联系起来;(iii)利用Cu和/或Cu- gr复合结构的不同电学和热学性能,设计和制造柔性电子原型,并研究其与微结构和环境刺激相关的功能和性能。本研究将使用铜离子(如Cu2+和Cu+)和水溶性聚合物(如聚乙烯吡咯烷酮- pvp、聚乙二醇- peg和单宁)油墨,在经过适当的表面处理后涂覆在基材(塑料、硅、纸)表面。激光书写参数包括激光功率、扫描速度、波长等。先进的分析技术将用于研究Cu和Gr的形成以及Cu晶粒或Cu- Gr界面上的缺陷。电/热导率和机械性能的书面结构将被表征。模拟将用于了解激光短时间内Cu表面上Gr的生长。纯Cu和Cu- gr复合结构将被集成到柔性衬底上的功能器件中,如气体/应变传感器和光电探测器,以测试其性能。该研究项目的成功实施将对材料科学中激光-物质相互作用和微观结构-性能相关性的科学现象提供基本的理解,特别是在激光热的产生,金属铜的熔化和凝固,连接过程中的原子扩散,激光转化石墨烯的碳化和结晶,以及界面结构或缺陷对性能的影响。这在电子制造和性能等实际应用中至关重要。该研究项目还将培养3名博士和3名硕士生和3名具有前沿知识和专业技能的pdf。这些学生和学员将在工业、学术和研究机构贡献他们的知识和技能,以提高加拿大未来在创新和创造力方面的竞争力。
英文摘要
This proposed research program will focus on direct laser writing process for rapid fabrication of copper-graphene (Cu-Gr) composite structures on various substrates for electronic applications by deeply understanding the correlations between laser processing conditions and interfacial structure of copper nanograins and/or copper-to-graphene junctions as well as electrical / thermal properties of composite structures and ultimately the performance of prototype flexible electronics. Three objectives of this research are to: (i) develop a one-step direct writing process for rapid patterning of Cu-Gr composite on various substrates; (ii) investigate the laser-induced heat generation, Cu nanoparticle formation and joining, polymer fast pyrolysis and Gr structure growing processes, particularly linking the laser heat generation to microstructures and defects at the interface of Cu-to-Cu and Cu-to-Gr to their conductivities; and (iii) design and fabricate prototype flexible electronics by utilizing different electrical and thermal properties of as-written Cu and / or Cu-Gr composite structures, and study their functions and performance related to microstructures and environmental stimuli. This research will use copper ion (e.g., Cu2+ and Cu+) and water soluble polymer (e.g., polyvinyl pyrrolidone-PVP, polyethylene glycol-PEG, and tannin) ink to coat the surface of substrates (plastics, silicon, paper) after proper surface treatment. Laser writing parameters will include laser power, scanning speed, wavelength, etc. Advanced analytical techniques will be used to investigate the formation of Cu and Gr and the defects at the interfaces of Cu grains or Cu-to-Gr. Electrical / thermal conductivities and mechanical property of as-written structures will be characterized. Simulations will be used to understand the growth of Gr on Cu surface under laser irradiation in a short time period. The as-written pure Cu and Cu-Gr composite structures will be integrated into functional devices on flexible substrates such as gas / strain sensor and photodetector to test their performances. The successful execution of this research program will provide a fundamental understanding of scientific phenomena in laser-mater interactions and microstructure-property correlation in materials science, specifically in laser heat generation, melting and solidification of metallic copper, atomic diffusion during joining, carbonization and crystallization of laser converted graphene, and effects of interfacial structures or defects on properties. This is of vital importance in practical applications, such as electronic fabrication and performance. This research program will also train 3 PhD and 3 MASc students and 3 PDFs with cutting edge knowledge and professional skills. These students and trainees will then contribute their knowledge and skills in industries, academic and research institutions to enhance Canada's future competitiveness in innovation and creativity.
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Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
  • 批准号:
    RGPIN-2020-04167
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.77万
  • 财政年份:
    2022
  • 负责人:
    Peng, Peng
  • 依托单位:
Developing high-entropy alloy coatings on different engineering alloys with electro-spark deposition
  • 批准号:
    568598-2021
  • 项目类别:
    Alliance Grants
  • 资助金额:
    $3.37万
  • 财政年份:
    2021
  • 负责人:
    Peng, Peng
  • 依托单位:
Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
  • 批准号:
    RGPIN-2020-04167
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.77万
  • 财政年份:
    2020
  • 负责人:
    Peng, Peng
  • 依托单位:
Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
  • 批准号:
    DGECR-2020-00531
  • 项目类别:
    Discovery Launch Supplement
  • 资助金额:
    $0.91万
  • 财政年份:
    2020
  • 负责人:
    Peng, Peng
  • 依托单位:
国内基金
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