Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics

该研究计划将专注于直接激光写入工艺，通过深入了解激光加工条件与铜纳米颗粒和/或铜-石墨烯结的界面结构以及电/机械性能之间的关系，在各种基底上快速制备铜-石墨烯（Cu-Gr）复合结构，以用于电子应用。复合结构的热性能以及最终原型柔性电子器件的性能。本研究的主要目的有三：（1）发展一步直写法在不同基底上快速图形化铜-石墨复合材料;（ii）研究了激光诱导热生成、Cu纳米粒子的形成和连接、聚合物快速热解和Gr结构生长过程，特别是将激光热生成与Cu-至-Cu和Cu-至-Gr的界面处的微结构和缺陷与它们的电导率联系起来;以及（iii）通过利用所写的Cu和/或Cu-Gr复合结构的不同电和热性质来设计和制造原型柔性电子器件，并且研究它们与微结构和环境刺激相关的功能和性能。本研究将使用铜离子（例如，Cu 2+和Cu+）和水溶性聚合物（例如，聚乙烯吡咯烷酮-PVP、聚乙二醇-PEG和单宁）油墨，以在适当的表面处理后涂覆基材（塑料、硅、纸）的表面。激光写入参数将包括激光功率，扫描速度，波长等先进的分析技术将被用来调查的Cu和Gr的形成和缺陷的Cu晶粒或Cu到Gr的界面。电/热传导率和机械性能的写入结构将被表征。模拟将被用来了解在短时间内的激光照射下的Cu表面上的Gr的生长。所写的纯铜和Cu-Gr复合结构将被集成到柔性衬底上的功能器件中，如气体/应变传感器和光电探测器，以测试它们的性能。 该研究计划的成功执行将提供对材料科学中激光-物质相互作用和微观结构-性能相关性的科学现象的基本理解，特别是在激光热生成，金属铜的熔化和固化，连接过程中的原子扩散，激光转化石墨烯的碳化和结晶，以及界面结构或缺陷对性能的影响。这在实际应用中至关重要，例如电子制造和性能。该研究计划还将培养3名博士和3名MASc学生以及3名具有尖端知识和专业技能的PDF。这些学生和学员将在工业、学术和研究机构贡献他们的知识和技能，以提高加拿大未来在创新和创造力方面的竞争力。

This proposed research program will focus on direct laser writing process for rapid fabrication of copper-graphene (Cu-Gr) composite structures on various substrates for electronic applications by deeply understanding the correlations between laser processing conditions and interfacial structure of copper nanograins and/or copper-to-graphene junctions as well as electrical / thermal properties of composite structures and ultimately the performance of prototype flexible electronics. Three objectives of this research are to: (i) develop a one-step direct writing process for rapid patterning of Cu-Gr composite on various substrates; (ii) investigate the laser-induced heat generation, Cu nanoparticle formation and joining, polymer fast pyrolysis and Gr structure growing processes, particularly linking the laser heat generation to microstructures and defects at the interface of Cu-to-Cu and Cu-to-Gr to their conductivities; and (iii) design and fabricate prototype flexible electronics by utilizing different electrical and thermal properties of as-written Cu and / or Cu-Gr composite structures, and study their functions and performance related to microstructures and environmental stimuli. This research will use copper ion (e.g., Cu2+ and Cu+) and water soluble polymer (e.g., polyvinyl pyrrolidone-PVP, polyethylene glycol-PEG, and tannin) ink to coat the surface of substrates (plastics, silicon, paper) after proper surface treatment. Laser writing parameters will include laser power, scanning speed, wavelength, etc. Advanced analytical techniques will be used to investigate the formation of Cu and Gr and the defects at the interfaces of Cu grains or Cu-to-Gr. Electrical / thermal conductivities and mechanical property of as-written structures will be characterized. Simulations will be used to understand the growth of Gr on Cu surface under laser irradiation in a short time period. The as-written pure Cu and Cu-Gr composite structures will be integrated into functional devices on flexible substrates such as gas / strain sensor and photodetector to test their performances. The successful execution of this research program will provide a fundamental understanding of scientific phenomena in laser-mater interactions and microstructure-property correlation in materials science, specifically in laser heat generation, melting and solidification of metallic copper, atomic diffusion during joining, carbonization and crystallization of laser converted graphene, and effects of interfacial structures or defects on properties. This is of vital importance in practical applications, such as electronic fabrication and performance. This research program will also train 3 PhD and 3 MASc students and 3 PDFs with cutting edge knowledge and professional skills. These students and trainees will then contribute their knowledge and skills in industries, academic and research institutions to enhance Canada's future competitiveness in innovation and creativity.