液态金属柔性电子中液固金属互连结构的可靠性研究

柔性是电子电路发展的必然趋势，液态金属作为一种兼具导电性和流动性的新型功能材料，在柔性电子技术中展现出诸多优点，可以很好的满足未来电子产品发展的需求。在液态金属柔性电路中，液态金属除了作为电路导线，还通过固体金属引脚与电子元器件相连，这一液固金属互连结构的紧密程度直接影响着柔性电路的电气连通质量与力学性能。因此，其可靠性的评估对液态金属柔性电子的制备和应用均具有非常重要的意义，也是目前尚未得到系统研究的课题。本项目以液态金属柔性电路中液固互连结构为研究对象，通过实验观察和分析液态金属与固体金属的润湿行为，建立润湿动力学模型。本项目还将评估影响润湿行为的因素，进而提出并验证改善液固润湿性能的方法。最后，本项目将针对液固互连结构的热疲劳性和机械疲劳性开展研究，建立液态金属柔性电路热分析模型和机械可靠性模型，从而提出液固互连结构的可靠性预测方法和优化方法。

It is an inevitable trend for the development of the flexible electronics. As a new functional material with both conductivity and fluidity, the liquid metal performs well in the fabrication of the flexible circuits, which is promising to meet the demand for future electronic products. For the liquid metal flexible electronics, the liquid metal does not only play the role of wire, but is also the direct connection to the solid IC pin. The quality of the liquid-solid metal interconnection determines the electrical and mechanical performance to a rather large extend. Thus, it is quite vital to study the reliability of the liquid-solid interconnection in the liquid metal flexible electronics. This project is aimed at exploring the wettability between the liquid metals and solid metals. Experiments are designed to observe and analyze liquid-solid wetting, which will help to build the materials' wetting kinetic models. Further, the factors affecting the wettability would be evaluated and some new methods to improve the wettability would be proposed and tested. After that, in order to establish the methods to predict and improve the reliability of the structure, research would also be carried out on the thermal and mechanical fatigue concerning the liquid-solid metal interconnection.