基于电子束诱导的纳米结构成形机理与调控方法研究

伴随着机器人技术及消费电子技术的快速发展，对半导体芯片与微纳传感器的小型化需求与日趋增。本项目针对半导体产业电子器件10 nm线宽以下的互连技术需求，基于金属纳米粒子在电子束诱导下的功率密度与温度场模型，结合分子动力学方法进行外加温度场作用下的熔融过程仿真，探索多种不同金属纳米粒子的熔融机理；研究熔融金属粒子的表面张力、极化后静电力及其与基底间黏着力的耦合作用机理，建立电子束熔融金属粒子极化迁移模型。基于扫描电子显微镜开发金属纳米结构图案化直写技术，构建基于电子束虚拟化操作器的纳米结构直写平台，建立自动化金属纳米结构机电特性测量系统，开展电子束诱导直写金属纳米结构过程中聚焦电子束束斑尺度、加速电压、移动速度、轨迹规划与金属纳米结构形貌及性能映射关系的实验研究，建立多金属纳米结构直写控型孔性的关联函数，基于上述函数复杂纳电极进行图案化互联实验。

Nano interconnection technology is rapid demanded to semiconductor industry under 10 nm scale. Based on the model of electron beam melting (EBM) power density and thermal field, with molecular dynamics simulation of metal nano particle melting, nano particle melting mechanism is investigated on micro-nano scale. By research on coupling mechanism of melted metal nano particle surface tension force, electro-static force and adhesion force with the substrate，model the metal melting nano particle polarization and transfer. Develop the pattern writing technology of metal nano structure technology via scanning electron microscope and construct the experimental system with online mechanical and electrical measurement to carry out the experiment of mapping relation of electron beam spot size, acceleration voltage, spot speed, trajectory planning to morphology and properties of metal nano structure. Build a function of this mapping relation for application of nano electrodes patterning interconnection.