本项目针对低温共烧陶瓷(LTCC)这一近年非常热门的射频三维封装技术在30-300 MHz VHF频段滤波电路设计所面临问题开展科学研究。现代通信系统工作频率和集成度越来越高，但超外差电路中频大多在30-300 MHz的VHF频段，在如此低的频段实现滤波电路的小型化和高度集成是极富挑战性，并急需解决又非常重要的基础性研究课题。目前，中频频段多采用价格高、带内插损大、需要外围匹配电路的声表面滤波技术。鉴于此，本项目旨在以LTCC三维封装技术下，VHF频段为具体应用背景，有效结合调谐式空间映射算法，研究高集成度三维滤波电路设计，以及高效的三维电路建模、优化方法及其应用。内容包括：受限空间情况下大参数电容、电感的实现及其杂散抑制；新型滤波拓扑电路与谐振器结构；高效建模和优化方法。本项目的研究不仅能够为VHF频段滤波电路设计提供可靠的理论依据和高效的设计方法，也为射频电路及组件的设计提供技术指导。

The investigations on low temperature co-fired ceramic (LTCC) based filtering circuits for 30-300 MHz VHF band applications are presented in this fund. LTCC is a popular technology in recent years, which is served for 3D RF integration. Although the working frequencies and integration level of modern communication devices become higher and higher, the intermediate frequency (IF) of superheterodyne circuits remind in 30-300 MHz VHF band, which is hard and challenging to build compact, highly integrated passive components. So the investigation is a necessary and important subject to study. Currently, surface acoustic wave (SAW) filters dominate in the VHF band, which are with high cost, high insertion loss and several match elements needed. For that reason, this investigation is for 3D filter design in VHF band with high efficient optimization methods, which includes high-capacitance capacitor and high-inductance inductor realizations with spurious spikes suppression, filtering topology, compact 3D resonators and high efficient optimization method. The study not only shows reliable theory and efficient design of 3D filters, but also an instruction for 3D radio frequency circuits and systems design.