基于UV-LIGA工艺加工的微波器件由于体积轻巧、精度高、频率高、信号容量大而成为现在射频微波电子设备的研究目标。本项目研究的RF微波器件大都在毫米级别，采用机械加工难度较大，因此提出一种新型的加工方法，拟采用SU8、KMPR等光敏材料制作高深宽比模具，采用多层多次对准光刻工艺和多层多次微结构的电铸工艺，对工艺过程出现的各种问题进行分析、总结，最终得到一套完整的基于UV-LIGA工艺的微波器件加工技术参数。本项目将以Ka波段(中心工作频率约为38GHz)的毫米波腔体滤波器作为具体研究内容，对滤波器腔体进行结构设计和优化仿真，设计出合理的加工工艺流程，最终制备出结构简单、性能优越的微波器件。

Since microwave devices based on UV - LIGA technology have the advantages of small volume , high precision, high frequency and large capacity ,they have became the research target of RF microwave electronic devices now . The RF spectrum microwave devices researched in this project are in millimeter level, however the domestic mechanical processing method is difficult, so a new kind of machining method is put forward, this project intends to adopt photosensitive materials such as SU-8 and KMPR to fabricate high aspect ratio mold, analyzes the various problems occured in the process of multi-layer repeated lithography and multi-layer microstructures electroforming, then summarize a complete set of process parameters based on UV - LIGA technique . This project will use ka-band millimeter wave cavity filter as a specifical object whose center frequency is about 38 GHZ. Through the structure design and simulation optimization of the filter chamber, we will find n appropriate technological processes. Finally we will achieve the microwave device with low cost, small size and high performance .