聚氨酯基导电复合材料广泛应用于电子工业、建筑工业和航空等领域。鉴于在聚氨酯中加入导电填料会导致填料粒子与基体界面结合不牢固、易脱落等问题，本项目提出了通过将金属离子与聚氨酯形成络合物的方式制备导电性聚氨酯的研究思路。设计合成一类含咪唑功能团的新型聚氨酯，利用Langmuir-Blodgett技术使Ag(I)与咪唑基团在界面均匀络合，形成Ag(I)络合的聚氨酯薄膜；通过原位还原使金属以纳米粒子的形式镶嵌在聚合物基体中由此形成纳米粒子分散均匀、与基体界面结合牢固的复合薄膜；通过控制咪唑基团在分子中的比例和薄膜的厚度（层数），以及原位还原成银纳米粒子的条件、银纳米粒子向薄膜表面迁移的程度，建立薄膜结构与薄膜导电性之间的构效关系，获得薄膜厚度可控、导电能力可控且高度有序的聚氨酯薄膜；在此基础上，分析和阐明该类复合薄膜的导电机制，为其在有机电子器件、传感器方面获得广泛应用奠定坚实的基础。

Polyurethane-based conductive composites are widely used in the electronics industry, construction industry, aviation field, etc. In view of the problems encountered in the polyurethane composites where the combination interface between the fillers and the matrix is not firm and the fillers are fallen off easily, this project proposes a novel research idea that the conductive polyurethane will be constructed in the form of the complexes formed by metal ions and polyurethane. First, a kind of new polyurethanes containing imidazole functional groups will be designed and synthesized. Polyurethane/Ag(I) films will be formed by Langmuir-Blodgett technique that makes Ag(I) coordinate with imidazole groups uniformly at the air/water interface. Secondly, through in-situ reduction, the metal ions will be changed into nanoparticles embedded in polymer matrix and thus a kind of polyurethane/Ag nanocomposite films, in which the nanoparticles are uniformly dispersed and firmly combined with the interface of matrix, are formed. Thirdly, the relationship between the film structure and film conductivity will be established by controlling the ratio of imidazole group in the molecule, the thickness (layers) of the film, and in-situ reductive conditions as well as the extent of the silver nanoparticles migration to the surface, then the controllable film thickness, controllable conductive capacity and highly ordered polyurethane films will be obtained. On the basis, analyzing and elucidating the conductive mechanism of such polyurethane/Ag composite films will lay a solid foundation for their wide application in organic electronic devices, sensors, etc.