本项目的提出源自目前工业生产、科学研究、生命医学等领域对严苛环境下高精度温度测量技术的新要求，以荧光温度传感器核心组成部分温敏材料为研究主体，基于负热膨胀特性开发一种高灵敏、快响应的A2M3O12-Re型钨钼酸盐荧光温敏材料。创新性地利用随温度变化时目标材料中桥氧原子的横向运动、刚性多面体的耦合转动、电子价态转变等内在作用，进行材料晶体结构和电子结构的精细化、大范围调制，探讨这种基质特征基团或离子结构的键长键角随温度变化对能级构建或能量传递路径/效率的影响规律，实现基质基团与荧光中心多能级体系的可控筑建，阐述荧光特性剧烈变化背后的光物理机制；在此基础上，通过多层结构荧光温敏材料的设计和优化，调节泵浦光源的组成等实现荧光中心吸收率的选择性增加和调节，放大基于荧光强度比的发光信号，并完成荧光温度传感器件的封装与灵敏性/分辨能力的测试，为实验室研究向应用化过渡提供科学指导和理论支持。

This project derives from the new requirements of high-precision temperature measurement in very harsh and complex environments in the fields of industrial production, scientific research, biomedicine, and so on. With temperature-sensitive materials as the core component of fluorescent temperature-sensitive sensors for the main research, we plan to develop a kind of high sensitivity and fast response A2M3O12-Re type molybdate or tungstate materials based on negative thermal expansion characteristics. Using the internal interaction of atomic transverse motion, coupling rotation of polyhedron and valence change in the A2M3O12-Re host with the increase of temperature, we carry out the fine refinement and large-scale adjustments of crystal structure and electronic structure of target materials, discuss the influence of changes of bond lengths and angles on the energy levels and efficiencies and paths of energy transfer, and then achieve the reconstruction of multiple energy level system and elaborate the photophysical mechanism. And on this basis, the fluorescence signals are further amplified by structural design and adjustment of pump light sources. Finally, the sensitivity and resolution of target materials will be assessed by the device packaging and photoelectric performance test. This work will be able to provide an important theoretical support for industrialization development of fluorescent temperature-sensitive sensors.