力-电场作用下薄膜-功能梯度材料基底结构的界面黏附研究

在复杂力电场环境下，薄膜-基底结构常因材料失配而出现界面失效，这极大地限制了航空航天和柔性电子技术的发展。而采用薄膜-功能梯度材料基底结构有望解决这一难题。此外，功能梯度材料工程应用面临的健康监测和控制等也势必带来力电场下薄膜-功能梯度材料结构的界面问题。因此，本项目将通过实验和理论建模，系统研究力电场作用下薄膜-功能梯度材料结构的界面黏附性能，揭示薄膜及功能梯度材料的几何及物理特性对此新型结构界面黏附的影响机制。首先，应用鼓泡法开展力电场下薄膜-功能梯度材料基底结构的界面强度实验；其次，基于连续介质力学框架，建立力电场下薄膜与功能梯度材料的黏附接触力学模型，系统分析不同载荷模式下薄膜及功能梯度材料的几何及物理特性等对界面黏附的影响规律；最后，综合理论和实验结果，探索薄膜-功能梯度材料基底结构界面优化方法。研究成果能为柔性电子设计、结构健康监测和控制提供理论指导，并推进表/界面力学的发展。

Under complex mechanical and electric environment, the development of both aerospace engineering and flexible electronics is restricted significantly by the interfacial failure of the film-substrate structures caused by the mistmatch between different materials. However, it is possible to solve this issue by using the film-functionally graded material (FGM) substrate structures. What is more, the health monitoring and controlling of FGMs also involve the interfacial problem of the film-FGM substrate structures under mechanical-electric fields. Thus, the interfacial adhesion of the film-FGM substrate structures under mechanical-electric fields will be investigated in this study by experiment combining theoretical analysis, in which the influences of geometrical and physical properties of both the film and the FGM substrate will be uncovered. Firstly, the blister test experiment will be used to measure the interfacial strength of the film-FGM substrate structure under mechanical-electric fields. Secondly, adhesive contact models of thin films on FGM substrates will be established under mechanical-electric fields in the framework of continuum mechanics. And the influences of load types, geometrical and physical properties of both the film and the FGM substrate on the interfacial adhesion will be discussed comprehensively. Finally, combining the experimental research and theoretical analysis, optimization methods will be proposed to improve the interfacial adhesion of the film-FGM substrate structures. The achievements of this project can not only provide theoretical guidance for the design of flexible electronics and the health monitoring and controlling of structures, but also develop the surface/interface mechanics.