MEMS引信服役在高达数万g的极端加速度与高低温环境中，其在服役环境下的可靠性研究相对滞后，制约着引信技术的进一步发展。由于微型冲击加载与测试系统和技术的缺乏，MEMS微器件的制作材料在高应变率下的动态力学性能研究难以开展，对MEMS引信及其关键微器件的动态特性深入研究陷入瓶颈。本项目立足于发展MEMS微器件及其制作材料动态力学性能研究的冲击加载、测试技术与系统。全面系统的开展基于电磁脉冲多级发射的微型高g值高低温加载环境系统、微型霍普金森拉压杆系统的研制工作；发展针对于高g值冲击载荷下微器件变形分析的高速显微光学测量技术与系统；利用研制的系统对MEMS微弹簧及其制作材料、典型MEMS引信安保机构的动态特性进行系统研究，分析MEMS引信安保机构和微弹簧在不同的高g值高低温载荷下的动态响应模式，揭示其失效机理，为MEMS引信及其关键微器件的安全可靠的服役提供坚实的基础。

MEMS fuze is usually served in harsh environment of undergoing high/low-temperature and high-g acceleration up to several tens thousands. Investigation of the security and reliability during the launching circumstances is relatively lagging behind, which restrict its development. The study on dynamic mechanical properties of MEMS material under high strain rate are difficult to carry on because of the lack of mini impact test systmes and techniques, which makes the further study of dynamic failure of the MEMS fuze run into a bottleneck. This project is devoting to developing mini impact test systems and techniques for investigating dynamic mechanical properties of MEMS fuze and its producing materials. The miniature high-g and high/low-temperature loading systems, and the mini SHP/TB systems will be developed based on multi-stage electromagnetic launching. The high speed microscopic optical measurement system and techniques will also be developed, which are for dynamic deformation analysis of micro devices under impact loading. Using the developed systems, the dynamic response of typical MEMS fuze and micro springs as well as its producing material under different accelerations and temperature will be investigated, and the mechanism of the failure mechanisms can be revealed, which will provide a solid foundation for the secure and reliable serving of MEMS fuze and its key devices.