平面自封装5G毫米波滤波器研究

随着5G毫米波移动通信的发展，对滤波器的小型化低成本、易集成和封装等提出了更高的要求，毫米波滤波器设计面临巨大的挑战。基片集成波导（SIW）滤波器存在辐射损耗和表面波，实际应用需要进行封装；间隙波导（GW）滤波器虽然解决了空间辐射和表面波问题，但体积大，难以集成。本项目提出采用自封装基片集成间隙波导（SP-SIGW）技术开展5G毫米波滤波器研究，包括传输微带线和滤波器。项目将采用等效电路理论对SP-SIGW传输微带线和滤波器的理论开展研究，通过电磁耦合设计理论的进一步分析，对滤波器电路之间的耦合机理进行深入探讨；结合电磁仿真，研究实现SP-SIGW平面化自封装的微带传输线，进而提出基于SP-SIGW技术的平面化自封装的5G毫米波滤波器。项目研究将能以低成本实现易集成的平面化自封装5G毫米波滤波器，对未来5G大规模MIMO移动通信网络和物联网的发展以及整个毫米波技术的发展具有重要研究意义。

As the future 5G millimeter wave mobile communication develops, higher requirements are come up for filters such as miniaturization, low-cost, easy-integration and packaging, which makes the design of millimeter wave filters face huge challenges. It is known that millimeter wave substrate integrated waveguide (SIW) filters have drawbacks of surface waves and spatial radiation, so they need packaging in practical application. Gap waveguide (GW) technology-based filters can solve the problems of surface waves and spatial radiation, but they are too bulky to integrate. This project proposes a methodology of employing self-packaging substrate integrated gap waveguide (SP-SIGW) technology to explore and investigate 5G millimeter wave filtering devices including transmission microstrip lines and filters. For the first step, the project will study the theory of SP-SIGW transmission microstrip lines and filters using equivalent circuits theory and research deeply into the coupling mechanism of filter circuits using the electromagnetic coupling design theory. For the second step, the project will adopt the electromagnetic simulation tools to realize SP-SIGW planar self-packaging microstrip lines and put forward SP-SIGW technology-based planar self-packaging 5G millimeter wave filters. Through researches in this project, the planar self-packaging 5G millimeter wave filters can be low in cost and easy for integration. And this project is of great importance to the development of the future 5G massive MIMO mobile communication networks and internet of things and the development of the millimeter wave technology.