金刚石/铜复合材料热膨胀与热传导的协同优化机理研究

金刚石/铜复合材料是新一代电子封装热管理材料的研究热点。目前金刚石主要以颗粒形式均匀分布在铜中，国内外通过基体合金化和颗粒表面改性在改善界面结合、提高导热性能方面取得了较好发展，但受离散构型的制约仍未达到理想效果。本项目从构型设计、界面调控和制备工艺的协同优化出发，结合基体合金化和金刚石表面改性层设计，通过单晶/多晶金刚石自支撑片与铜复合将颗粒/连续金刚石与铜形成的微观界面放大到宏观尺度，研究金刚石/铜复合界面形成机制及其对界面热阻和热膨胀匹配的影响机理；通过金刚石颗粒、三维连续网络骨架及二者混杂增强的实验测试与理论计算，研究离散界面和连续界面对金刚石/铜复合材料热性能的作用机理。通过厘清上述两个关键科学问题，建立金刚石/铜复合材料的构-效关系，揭示金刚石/铜复合材料热膨胀与热传导的协同优化机理。本项目的顺利实施将为高导热、低热膨胀金刚石/铜复合材料的设计与制备提供新思路和实验理论依据。

Diamond/Cu composites have become the new research hotspot of the electronic packaging thermal management materials. At present, great progress has been made in improving interface bonding and enhancing thermal property by surface metallization and matrix alloying. However, the diamond reinforcements are mainly uniformly distributed in Cu matrix in the form of particles. Due to the restriction of isolated architecture, the composites still did not exhibit ideal thermal conductivity yet. In this project, the synergistic effect of architecture design, interface regulation and fabrication process has been investigated. By combining the surface metallization and matrix alloying methods, diamond particle/Cu and continuous diamond film/Cu interface will be investigated by the design of interface on the single-crystal and polycrystalline diamond plates. The formation mechanism of diamond/Cu interface and its influence on interfacial thermal conductance and thermal expansion matching will be clarified. Besides, through the experimental results and theoretical calculation of the thermal properties of diamond/Cu composites reinforced with diamond particles (DP), 3D continuous diamond networks (DN) and hybrid structure of DP/DN, the Influence mechanism of isolated interfaces and continuous interfaces on the thermal properties can be clarified. By illustrating the above two key scientific problems, the coupling mechanism between DP and DN on the thermal property of the diamond/Cu composites can be revealed, and the relationship between “architecture & interface” and “thermal property enhancement” can be established. This research will bring a new inspiration and theoretical basis for the design and fabrication of diamond/Cu composites with high thermal conductivity and low thermal expansion.