鉴于未来高能物理实验如环形正负电子对撞机（CEPC）和国际直线对撞机（ILC）对低物质量、高空间分辨率顶点探测器的需求，本项目针对顶点探测器传统的单面型硅像素探测模块设计难以满足测量精度要求的问题，研究基于双面型硅像素探测模块的顶点探测器的关键研制技术及测试方法。探索双面型结构探测模块的设计、制作方法，在确保其刚度的情况下，减小物质量，提高其测量精度；研究芯片在模块上的精确定位方法及探测器的集成技术，完成探测器模型的建造及高速读出电子学系统的研发；通过束流实验，研究芯片击中位置的重建算法、寻迹以及芯片的校准方法，提高探测器的性能，实现探测器模型的物质量小于0.3%X0/层，空间分辨好于5µm。本项目的研究为低物质量、高空间分辨率的高性能顶点探测器的研制及测试分析方法积累经验，将积极推动顶点探测器在国内的研究和发展。

The vertex detector with low material budget and high spatial　resolution is required in the future high energy physics experiments, such as the Circular Electron and Positron Collider and the International Linear Collider. Since the　traditional single-sided silicon pixel ladder can not meet the requirement of　the measurement accuracy, the key construction technologies and test methods for the high performance vertex detector based on double-sided silicon pixel ladder will　be studied in this project.　We will study the design and the assembly of the double-sided ladder to reduce the material budget, improve the measurement accuracy and ensure　its high rigidity at the same time. Improve the location accuracy of the sensors on the ladder and the integration technology of the detector, and complete the construction of a detector prototype with 3-4 double-sided ladders and the development of the high speed readout electronics system. The beam test of the prototype will be performed. The chip alignment, the hit position reconstruction and tracking algorithm　will be developed and optimized to improve the performance of the prototype, and make it achieve the expected　goals of the spatial　resolution better than 5µm and the material budget less than 0.3% X0 /layer. These studies will solve some key issues, gain experience in the development techniques and test methods for the high performance vertex detector with low material budget and high spatial　resolution , and promote the domestic research on this kind of detector.