基于区域分解法的先进封装电-热多物理场仿真与应用

随着射频技术的发展和5G时代的来临，射频封装已经呈现出更低成本，更高频率，更高功率和更高密度功能集成的趋势，三维封装、异构集成等先进封装技术应运而生，因而显著增加了射频系统热管理、电磁兼容和信号/电源完整性的设计复杂度。为实现先进封装系统的精确全波仿真，需要求解大规模、跨尺度、多物理问题，这给计算电磁学带来了极大地挑战。项目聚焦大规模射频先进封装系统的电-热多物理场仿真难题，研究内容包括：(1)研究基于Robin传输条件-间断伽略金微分方程区域分解算法。(2)结合区域分解算法联合求解波动方程和热力学方程从而实现电-热多物理场高效快速协同仿真。(3)应用提出的算法对先进封装中电磁兼容和信号/电源完整性问题进行分析。研究成果将为先进封装的系统设计和工艺优化提供理论支撑与技术支持。

With the development of radio-frequency technology and the advent of the 5G era, radio-frequency packaging has shown a trend of lower cost, higher frequency, higher power and higher density function integration. Advanced packaging technologies such as three-dimensional packaging and heterogeneous integration have emerged. Hence, the design complexity of the thermal management, electromagnetic compatibility, and signal/power integrity for the radio-frequency system is significantly increased. In order to achieve accurate full-wave simulation of advanced packaging systems, large-scale, multi-scale, and multi-physics problems need to be solved, which brings great challenges to computational electromagnetics. The project focuses on the electrical-thermal multi-physics simulation problems of large-scale radio-frequency advanced packaging systems. The research contents include: (1) Research on the Robin transmission conditions-discontinuous Galerkin enriched domain decomposition algorithm based on the differential equation. (2) Appling domain decomposition algorithm to realize efficient and accurate collaborative electric-thermal multiphysics simulation by solving wave equation and thermodynamic equation. (3) Apply the proposed algorithm to analyze electromagnetic compatibility and signal/power integrity issues in the advanced packaging. The research results will provide theoretical and technical support for the design and technology optimization of advanced packaging systems.