用于移动设备的3D集成、多路输出DC-DC变换器关键技术研究

现代移动设备迫切需要小型化、高效率、低纹波、高动态响应、多路稳压输出的DC-DC变换器，然而由于体积和工艺成本限制，目前的技术在单芯片集成上依然面临着诸多挑战。本项目将通过新型SC-SMPS复合变换器拓扑、临界导通电流模式控制、交错并联重构和3D集成设计的层层探索，突破有限空间、工艺成本下的多方面壁垒，实现高集成度、高效率、低纹波、高动态响应、多路稳压输出的DC-DC变换器芯片。项目分四个专题展开研究：（1）多路输出的SC-SMPS复合变换器拓扑及其验证；（2）适用于高频交错并联SMPS变换器的BCM电流模式控制及其同步策略；（3）基于交错并联重构的SMPS变换器轻载效率提升技术；（4）DC-DC变换器的3D集成设计。在上述研究的支撑下，本项目将完善DC-DC变换器的拓扑、控制、效率优化和3D集成理论，促进传统工艺下的DC-DC变换器高质量集成，为我国电源芯片产业发展提供一定的示范依据。

For modern mobile equipment, there is a continuous demand for DC-DC power converter that features minimized size, high efficiency, low ripple, fast dynamic response and stable multi-output voltage. However, with limited size and semiconductor process cost, the existing techniques are facing multiple challenges in achieving single chip integration. This project will explore new SC-SMPS hybrid converter topology, boundary conduction current mode control, configurable interleaving and 3D integration techniques. Relevant studies will break through the bottleneck under limited space and process cost, and realize highly integrated DC-DC converter chip that features high efficiency, low ripple, fast dynamic response and stable multi-output voltage. Detailed studies include: (1) Multi-output SC-SMPS hybrid converter topology and its verification, (2) BCM current mode control and its synchronization strategies for high frequency interleaved SMPS converter, (3) Light load efficiency improvement for SMPS converter based on configurable interleaving, (4) 3D integration techniques for DC-DC power conversion. Based on these studies, the project will contribute theories in DC-DC converter topology, current mode control, efficiency optimization and 3D integration. Finally, the outcome will facilitate high quality DC-DC power integration under conventional semiconductor process, and provide demonstrations to promote power chip industry in China.