基于GaN基micro-LED器件的LTPS-TFT驱动背板热效应模型研究

micro-LED器件是具有高色彩还原力、高清晰度、低功耗的下一代显示器件，随着产业化深入，其高可靠性和低功耗电路和信号设计将成为必须解决的问题。然而，现在尚无针对器件长期工作条件下，热效应对micro-LED、键合部位和像素及周边电路影响的评估工具和检验标准。着眼我国下一代显示技术布局，本项目基于LTPS-TFT工艺实现GaN基micro-LED及像素、周边电路模型构建，完成其SPICE嵌入，并从焦耳热诸来源出发，建立GaN基micro-LED背板电路热效应模型。同时，基于该模型仿真分析确定电路和信号设计热可靠性的判定条件；以可靠性判定条件为标准，从降低热积累和加强热耗散两方面着眼，探讨低功耗电路设计和信号设计，减轻结温和周边电路温度上升程度，增强整体设计的容忍度；有望揭示不同条件下导致热失效的关键因素，为micro-LED器件周边电路和信号设计提供快捷准确的可靠性评估工具。

As a candidate of next-generation display devices, micro-LED devices have the advantages of high color restoration capability, high definition and low power consumption, and their high-reliable and low-power-consumption circuitry and signal design shall be the problem which must be solved. However, there is no evaluation tools or standards focusing on the influences of thermal impacts on micro-LED, the bonding regions or driving circuitry on the condition of long-time working. For the next step of display research and technology of our nation, we shall build a model on GaN based micro-LED LTPS-TFT backplane circuitry on the base of Joule heating theory, and embed the model into a SPICE program, and build a model of backplane on the thermal effects of the driving circuitry. At the same time, a judging standard of thermal reliability shall be given basing on the model; designs of circuitry and signal for lower power consumption shall be proposed and evaluated which shall lower the thermal effect of the backplane, alleviating the increase of temperature of junction and periphery circuitry, and improving the tolerance of micro-LED device design; and figuring out the major factors on thermal failure on the conditions of different micro-LED sizes, and provide a fast and precise evaluation tool on the design of micro-LED backplane circuitry and signal.