Cu/SiCw无孔隙复合电沉积机理及热机械性能研究

随着半导体技术进步，芯片散热成为制约功率电子系统能力提升的主要障碍，高性能热沉材料创新开发受到高度重视。Cu/SiCp被公认为下一代热沉材料开发最佳方向，虽经该领域专家多年攻关但仍未成功，主要是因为高温合成过程中Cu与SiC之间的剧烈界面反应导致复合材料热导率远低于预期，并已成为亟待突破的行业技术瓶颈。本项目提出一种复合电镀制备无孔隙Cu/SiCw热沉材料的新工艺路线，以低温工艺（复合电沉积）代替高温合成，从根源上解决传统制备工艺存在的致命难题；以机械强度和热导率超高的SiCw代替传统SiCp以进一步增强其热、机械性；以无孔隙复合电沉积机制根除SiCw增强的复合材料孔隙率高的痼疾，开发一种综合性能优越的新一代热沉材料，建立Cu/SiCw基UV-LIGA成套工艺，研制冷却能力≥1kW/cm2的微通道热沉。最后测试并评估其综合性能，验证Cu/SiCw热沉材料创新开发思想的合理性和可行性。

With the advancement of semiconductor technology, chip heat dissipation has become a major obstacle restricting the improvement of power electronic systems. Therefore, the innovative development of high-performance heat sink materials has been highly valued. Copper-based silicon carbide particle composite (Cu/SiCp) is recognized as the best direction for the development of next-generation heat sink materials. However, after many years of research, it is still unsuccessful. The reason is that there will be a violent interfacial reaction between the base metal Cu and the reinforcing phase material SiC during the high-temperature synthesis process, resulting in the thermal conductivity of the composite material being much lower than expected, which has become a key technical bottleneck that needs to be broken. . This project proposes a new process route for preparing non-porous Cu/SiCw heat sink materials by composite electroplating, replacing high-temperature synthesis with a low-temperature process (composite electrodeposition), and solving the fatal problems of traditional preparation processes from the root. Using SiCw with ultra-high mechanical strength and thermal conductivity instead of traditional SiCp to further enhance its thermal and mechanical properties. Using non porous composite electrodeposition mechanism to eliminate SiCw enhancement. A new generation of heat sink material with excellent comprehensive performance was developed. A complete set of Cu / SiCw based UV-LIGA process was established, and a microchannel heat sink with cooling capacity ≥ 1kW/cm2 was developed. Finally, its comprehensive performance is tested and evaluated to verify the rationality and feasibility of the innovative development idea of Cu / SiCw heat sink material.