基于织物转印的有机无机复合一维光子晶体结构色构筑和性能研究

本项目基于有机无机复合一维光子晶体结构色的优良性能及其柔性膜材料研究方法，结合织物转印原理，创新性地构筑一种用于织物着色和图案化的有机无机复合一维光子晶体结构色材料，设计通过转印实现其在织物上的应用，并进行相关性能和机理研究。研究并实现低折射率聚合物和高折射率无机氧化物纳米溶胶的可控制备，在低表面能平面基材上通过层层自组装得到具有亮丽结构色的复合一维光子晶体，明确组装机理、材料结构与一维光子晶体光学、力学、热性能等的关系，建立安全稳定的组装体系和颜色调节机制，实现有机无机材料优势性能复合；明确一维光子晶体孔隙率、转印介质性能、聚合物纳米粒子固相连接成膜特性及织物结构等条件对转印效果的影响，实现结构色从低表面能刚性平面基材到柔性织物的转印和良好的着色效果。从源头材料设计、制备、组装、后续工艺及相关机理研究解决纺织品结构色着色和印花的关键科学和技术问题。

On the basis of the excellent performance of organic-inorganic composite one-dimensional photonic crystals and study method of their flexible films, and the principle of transfer printing, this project innovatively fabricates a kind of organic/inorganic composite one-dimensional photonic crystals with structural colors for coloration and printing of fabrics. A transfer printing method is designed for realizing application of the structural color materials on soft fabrics, and the related properties and mechanism will be studied. The controllable preparation of low-refractive-index polymer and high-refractive-index inorganic oxide sols will be studied and realized, and composite one-dimensional photonic crystals with brilliant structural colors will be assembled on low-surface-energy flat substrates through layer-by-layer assembly. The assembly mechanism and the relationship of the material structures and their optical, mechanical and thermal properties will be confirmed. Safe and stable assembly system and color modulating mechanism will be set up, and the advantageous performance of the organic and inorganic materials in one-dimensional photonic crystal assembly will be combined. The effect of the properties of porosity, transfer printing media, characteristics of polymer self-connection to form films and structures of the fabrics on transfer printing effects will be confirmed and transfer printing of the structural colors from low-surface-energy rigid flat substrates to soft fabrics will be implemented. Key scientific and technical problems in coloration and printing of structural colors on textiles will be solved from the studies of the material design, preparation, assembly, follow-up process and the related mechanism.