Kinetics of intermetallic compound growth between nickel, electroless, Ni-P, electroless Ni-B and tin at 453 to 493 K
Kinetics of intermetallic compound growth between nickel, electroless, Ni-P, electroless Ni-B and tin at 453 to 493 K
复制标题
453 至 493 K 下镍、化学镀、Ni-P、化学镀 Ni-B 和锡之间金属间化合物生长的动力学
DOI：
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发表时间：
1987
期刊：
影响因子：
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通讯作者：
H. G. Rhodes
中科院分区：
文献类型：
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作者：
W. Tomlinson;H. G. Rhodes
用显微和x射线衍射技术测定了在453 ~ 493 K温度下506 h镍、化学镀Ni-P和化学镀Ni-B镀层之间形成的金属间化合物的生长动力学、晶体结构和形貌。形成化合物Ni3Sn4。Ni/Sn、Ni- p /Sn和Ni- b /Sn体系的活化能分别为128.0、130.4和122.3 kJ mol−1。Ni3Sn4在Ni/Sn和Ni- p /Sn体系中的生长速率基本一致，但在Ni- b /Sn体系中的生长速率要快5倍。在Ni-P/Sn体系中形成的金属间化合物中出现了气孔，并讨论了气孔与相密度的关系。
The growth kinetics, crystal structure, and morphology of the intermetallic compounds formed between nickel, electroless Ni-P and electroless Ni-B coatings with tin at 453 to 493 K for times up to 506 h have been determined by microscopical and X-ray diffraction techniques. The compound Ni3Sn4 was formed. All kinetics followed as parabolic law with activation energies of 128.0, 130.4, and 122.3 kJ mol−1 for the Ni/Sn, Ni-P/Sn and Ni-B/Sn systems, respectively. The rate of growth of Ni3Sn4 in the Ni/Sn and Ni-P/Sn systems were similar but the rate of growth in the Ni-B/Sn system was five times faster. Pores occurred in the intermetallic compound formed in the Ni-P/Sn system and these are discussed in relation to the density of the phases.