Multilayer Microwires: Tailoring Magnetic Behavior by Sputtering and Electroplating
Multilayer Microwires: Tailoring Magnetic Behavior by Sputtering and Electroplating
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DOI：
10.1002/adfm.200304432
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发表时间：
2004-03
影响因子：
19
通讯作者：
K. Pirota;M. Hernández-Vélez;D. Navas;A. Zhukov;M. Vázquez
中科院分区：
文献类型：
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作者：
K. Pirota;M. Hernández-Vélez;D. Navas;A. Zhukov;M. Vázquez
发展了一种制备具有可控磁行为的多层微丝的新技术。该技术涉及结合溅射和电镀过程，以在玻璃涂覆的非晶磁性微丝上存款（磁性或非磁性）金属纳米和微米层。磁致伸缩非晶金属核的适当选择以及由沉积层引起的特定应力允许定制特定的磁行为。以这种方式，可以实现特征在于方形滞后环（典型的是具有纵向易磁化轴的磁性微线）或特征在于几乎非滞后环（对于具有周向易磁化轴的那些微线）的多层微线的制备。
A novel technique for preparing multilayer microwires with controlled magnetic behavior has been developed. This technique involves combining sputtering and electroplating procedures to deposit (magnetic or non‐magnetic) metallic nano‐ and microlayers onto glass‐coated amorphous magnetic microwires. A suitable choice of magnetostrictive amorphous metallic nucleus, together with the specific stresses induced by the deposited layers, allows the tailoring of specific magnetic behavior. In this way, the preparation of multilayer microwires characterized either by square‐shaped hysteretic loops (typical of magnetically bistable microwires with longitudinal easy axes), or by nearly non‐hysteretic loops (for those microwires with a circumferential magnetization easy axes), can be achieved.