Finite element formulation of coupled grain-boundary and surface diffusion with grain-boundary migration
Finite element formulation of coupled grain-boundary and surface diffusion with grain-boundary migration
复制标题
耦合晶界和表面扩散及晶界迁移的有限元公式
DOI：
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发表时间：
1997
期刊：
影响因子：
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通讯作者：
S. Kucherenko
中科院分区：
文献类型：
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作者：
Jingzhe Pan;A. Cocks;S. Kucherenko
建立了模拟晶界扩散、晶界迁移和自由表面扩散相结合的微观组织演化的有限元公式。这些公式基于统一的变分原理，允许对完全耦合的过程进行分析。例如，可以分析一个过程，它涉及沿弯曲和迁移的晶界网络的晶界扩散，以及沿与晶界网络相交的内部和/或外部自由表面的表面扩散。数值解提供了每个单独晶粒的速度以及晶界和迁移面的速度。将有限元公式与时间积分算法相结合，形成了一种可用于模拟多晶材料微观组织演变的数值技术。该技术可应用于广泛的物理问题，包括：粉末压块的烧结；晶粒生长;扩散孔洞扩展与裂纹扩展；电子薄膜的超塑性变形与形态演化。通过数值算例验证了该方法的有效性。
Finite element formulations are developed to model microstructure evolution by a combination of grain–boundary diffusion, grain–boundary migration and free surface diffusion. The formulations are based on a unified variational principle which allows fully coupled processes to be analysed. For example, a process can be analysed which involves grain–boundary diffusion along a curved and migrating grain–boundary network, coupled with surface diffusion along internal and/or external free surfaces which intersect with the grain–boundary network. The numerical solution provides the velocities of each individual grain and the velocities of grain–boundaries and migrating surfaces. The finite element formulations, when combined with a time integration algorithm, form a numerical technique which can be used to simulate microstructural evolution in polycrystalline materials. The technique can be applied to a wide range of physical problems including: sintering of powder compacts; grain–growth; diffusive void growth and crack propagation; superplastic deformation and the morphological evolution of electronic thin films. Various numerical examples are presented to demonstrate the effectiveness of the numerical technique.