Microdroplet deposition of copper film by femtosecond laser-induced forward transfer
Microdroplet deposition of copper film by femtosecond laser-induced forward transfer
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DOI：
10.1063/1.2364457
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发表时间：
2006-10
影响因子：
4
通讯作者：
Li Yang;Ching-yue Wang;X. Ni;Zhijun Wang;W. Jia;L. Chai
中科院分区：
文献类型：
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作者：
Li Yang;Ching-yue Wang;X. Ni;Zhijun Wang;W. Jia;L. Chai
采用激光诱导正向转移（LIFT）技术，在中心波长为775nm的148fs激光脉冲下，将铜微滴沉积在石英衬底上。以略高于铜膜完全去除阈值的激光脉冲能量转移直径为2 ~ 3μm的液滴。液滴的形成是在自由表面熔化时等离子体的压应力作用下将熔融膜从石英衬底吹出的结果，与利用纳秒激光脉冲的LIFT技术形成的微液滴不同。
Copper microdroplets were deposited onto a quartz substrate by the laser-induced forward transfer (LIFT) using laser pulses of 148fs at a center wavelength of 775nm. The droplets with 2–3μm diameters were transferred at a laser pulse energy slightly above the threshold at which the copper film could be removed completely. The droplet formation was a result of the blow-off of a molten film from the quartz substrate by a compressive stress of plasma when the free surface was melted and was different from the microdroplet formation by the LIFT technique using nanosecond laser pulse.