Investigations on the invalidated process and related mechanism of PEG during copper via-filling process
Investigations on the invalidated process and related mechanism of PEG during copper via-filling process
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DOI：
10.1016/j.apsusc.2008.10.099
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发表时间：
2009-01-15
影响因子：
6.7
通讯作者：
Li, Yong-Lei
中科院分区：
文献类型：
--
作者：
Li, Ya-Bing;Wang, Wei;Li, Yong-Lei
通过电化学极化和电化学阻抗(EIS)测量研究了PEG在铜填孔过程中的失效过程及相关机理，并利用红外光谱(IR)测量对PEG的失效产物进行了分析。结果表明，随着通过电荷（PC）的增加，PEG在阴极表面的吸附强度及其对铜还原的抑制逐渐减弱。阳极和阴极通电过程都会导致PEG失效，但其失效过程不同。 PEG会在阳极表面进一步聚合形成分子量更大的新的PEG，导致镀液的分散能力下降。结果，在铜通孔填充过程中，无法获得超填充行为，并且在样品表面上形成许多小波纹。反之，PEG会在阴极表面分解形成分子量较小的新PEG，导致PEG吸附能力和抑制能力下降。结果，在铜通孔填充过程中，无法获得超填充行为，并且样品表面的亮度下降。当阳极和阴极反应在同一镀液中同时发生时，PEG的分解比聚合更容易发生。因此，在铜孔填充过程中，PEG的主要失效产物是分子量较小的PEG。 (C) 2008 Elsevier B.V. 保留所有权利。
The invalidated process and related mechanism of PEG during copper via-filling process were investigated by means of electrochemical polarization and electrochemical impedance (EIS) measurements, and infra-red spectrum (IR) measurement was employed to analyses the invalidated products of PEG. The results suggest that the adsorption strength of PEG on cathode surface and its inhibition to copper reduction decrease gradually with the increase of passed charges (PC). Both the anodic and the cathodic electrifying process can cause the invalidation of PEG, but their invalidated courses are different. PEG will further polymerize to form new PEG with bigger MW on the anode surface, which causes the dispersive ability of plating solution to decrease. As a result, super-filling behavior cannot be obtained and many small wales formed on the specimen surface during copper via-filling process. Inversely, PEG will decompose to form new PEG with smaller MW on the cathode surface, which results in the decrease of PEG adsorption ability and inhibition. As a result, super-filling behavior cannot be obtained and the brightness of the specimen surface decreases during copper via-filling process. The decomposition of PEG is easily to happen than its polymerization when the anodic and cathodic reactions happen in the same plating solution simultaneously. So the main invalidated product of PEG during copper via-filling process is PEG with smaller MW. (C) 2008 Elsevier B. V. All rights reserved.