Modeling and analysis for thermal management in gallium oxide field-effect transistors
Modeling and analysis for thermal management in gallium oxide field-effect transistors
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DOI:
10.1063/1.5141332
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发表时间:
2020-04-21
影响因子:
3.2
通讯作者:
Graham, Samuel
中科院分区:
文献类型:
--
作者:
Yuan, Chao;Zhang, Yuewei;Graham, Samuel
Increased attention has been paid to the thermal management of beta -Ga2O3 devices as a result of the large thermal resistance that can present itself in part due to its low intrinsic thermal conductivity. A number of die-level thermal management approaches exist that could be viable for thermal management. However, they have not been assessed for beta -Ga2O3 devices exclusively. Here, we explore the limits of various die level thermal management schemes on a beta -Ga2O3 metal-semiconductor field-effect transistor using numerical simulations. The effects of the various cooling approaches on the device channel temperature were comprehensively investigated, along with guidance for material selection to enable the most effective thermal solutions. Among various cooling strategies, double side cooling combined with a heat spreader used in the active region of the device can suppress the device thermal resistance to as low as 11mm degrees C/W, achieving a maximum dissipated power density as high as 16W/mm for a junction temperature limit of 200 degrees C. A multi-finger transistor thermal model was also developed to assess the potential of beta -Ga2O3 devices for higher output power applications. Overall, this numerical study shows that it is possible to achieve high power beta -Ga2O3 device operation with appropriate die-level thermal management solutions.