Gold Wet Etch Optimization on 200mm Substrates for MEMS Applications
Gold Wet Etch Optimization on 200mm Substrates for MEMS Applications
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DOI：
10.1149/1.3202671
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发表时间：
2009-09
期刊：
影响因子：
6
通讯作者：
L. Gabette;R. Segaud;Sabrina Fadloun;X. Avale;P. Besson
中科院分区：
文献类型：
--
作者：
L. Gabette;R. Segaud;Sabrina Fadloun;X. Avale;P. Besson
由于宽松的图案尺寸和友好的湿法工艺成本，MEMS技术工艺流程包括许多湿法蚀刻工艺步骤。然而，随着尺寸的缩小，对于常用的金湿法蚀刻工艺，需要对光致抗蚀剂掩模下的金层进行有限的欠蚀刻。本文比较了浸没式和单片喷射式两种金湿法腐蚀工艺。
Thanks to relaxed pattern dimensions and friendly wet process cost, MEMS technology process flows include many wet etch process steps. Nevertheless, as dimensions are downscaling, for the frequently used gold wet etch process, a limited under etch of the gold layer under photo resist mask is required. This paper makes a comparison between gold wet etch processes respectively made in immersion mode and in a single wafer spray tool.