Experimental comparison between different configurations of PCM based heat sinks for cooling electronic components
Experimental comparison between different configurations of PCM based heat sinks for cooling electronic components
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DOI：
10.1016/j.applthermaleng.2015.05.024
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发表时间：
2015-08-05
影响因子：
6.4
通讯作者：
Ben Jabrallah, Sadok
中科院分区：
文献类型：
--
作者：
Gharbi, Salma;Harmand, Souad;Ben Jabrallah, Sadok
电子元件的热控制旨在确保其在与其性能兼容的温度范围内使用。本文对相变材料作为电子器件冷却系统的性能进行了实验研究。四种配置用于控制系统温度的升高：纯PCM、硅树脂基质中的PCM、石墨基质中的PCM和翅片系统中的纯PCM。不同的相变材料的热物理性能的测定和发现是可取的应用在这项研究中。采用固液界面可视化和温度演化来理解不同阶段的传热机制。结果表明，相变材料的加入降低了热沉的温升，使热沉的临界时间延长了一倍。采用PCM填充石墨基体比硅基体对系统热性能有更大的改善。此外，对于相同比例的铜，发现将具有合适间距的长铜鳍片并入PCM中可以增强PCM中的热分布，导致更长时间保持部件温度低于临界极限。因此，这项工作表明，PCM和长的，间隔良好的翅片的组合提出了一种有效的手段，用于电子设备的热控制。(C)2015爱思唯尔有限公司版权所有。
The thermal control of electronic components is aimed at ensuring their use in a temperature range compatible with their performances. This paper presents an experimental study of the behavior of phase change materials (PCMs) as the cooling system for electronic devices. Four configurations are used to control the increase in the system temperature: pure PCM, PCM in a silicone matrix, PCM in a graphite matrix and pure PCM in a system of fins. Thermo-physical properties of different PCMs are determined and found to be desirable for application in this study. Solid liquid interface visualization and temperature evolution are employed to understand the mechanism of heat transfer during the different stages. Results indicated that the inclusion of PCM can lower component increase temperature and extends twice the critical time of the heat sink. The use of Graphite matrix filled by PCM showed more improvement on system thermal performance than silicon matrix. Also, for the same fraction of copper, it was found that incorporating long copper fins with suitable spacing into PCM, can enhance heat distribution into PCM leading to longer remain component temperature below the critical limit. This work therefore shows that the combination of PCM and long, well-spaced fins presents an effective means for thermal control of electronic devices. (C) 2015 Elsevier Ltd. All rights reserved.