Tensile Properties of Polyamide Thin Films for Electronic Devices
Tensile Properties of Polyamide Thin Films for Electronic Devices
复制标题
电子设备用聚酰胺薄膜的拉伸性能
DOI：
10.2472/jsms.60.167
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发表时间：
2011
期刊：
影响因子：
--
通讯作者：
M. Sakane
中科院分区：
文献类型：
--
作者：
Shenmin Zhang;M. Oka;T. Nagasawa;K. Terada;Kaoru Kobayashi;M. Sakane
本文研究了四种不同填充量的电子器件用聚酰胺薄膜的拉伸性能。进行拉伸试验以确定聚酰胺薄膜的杨氏模量、比例极限、屈服应力、极限拉伸强度和伸长率。聚酰胺薄膜的杨氏模量随填料含量的增加而增加，Kerner模型能较好地模拟这一变化趋势。聚酰胺薄膜与42%的填料表现出最大的比例极限，屈服应力和极限拉伸强度。伸长率随填料含量的增加而降低。综合考虑薄膜的热膨胀系数和力学性能，最佳填料含量为40%左右。
This paper presents the results of tensile properties of four kinds of polyamide thin films with different contents of filler used in electronic devices. Tensile tests were performed to determine Young's modulus, proportional limit, yield stress, ultimate tensile strength and elongation of polyamide thin films. The Young's modulus of polyamide films increased with increasing the contents of filler, and the trend of the data was satisfactory simulated by the Kerner model. The polyamide film with 42% filler showed the largest proportional limit, yield stress and ultimate tensile strength. The elongation decreased with increasing the contents of filler. The most suitable filler content was around 40% from considering the coefficient of thermal expansion and mechanical properties of the films.