Miniaturized 122 GHz system-in-package (SiP) short range radar sensor
Miniaturized 122 GHz system-in-package (SiP) short range radar sensor
复制标题
小型化 122 GHz 系统级封装 (SiP) 短距离雷达传感器
DOI：
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发表时间：
2013
期刊：
影响因子：
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通讯作者：
T. Zwick
中科院分区：
文献类型：
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作者：
M. Girma;S. Beer;J. Hasch;M. Gonser;W. Debski;W. Winkler;Yaoming Sun;T. Zwick
本文提出了一种工作频率为 122 GHz 的紧凑型（8×8 mm2 封装尺寸）短距离双基地雷达传感器。目标是展示低成本表面贴装器件 (SMD) 封装中 SiP 解决方案的可行性。该毫米波集成电路基于 SiGe-BiCMOS 技术，可提供 280 GHz 的 fT 和 300 GHz 的 fmax。介绍了雷达传感器的设置，调频连续波 (FMCW) 调制的测量结果展示了雷达前端的性能。目标应用领域是短距离距离和速度测量，由于毫米波频率的波长短，因此在高分辨率距离测量方面尤其具有优势。该芯片面积为940μm×1450μm，消耗450mW的直流功率。
In this paper, a compact (8×8 mm2 package size) short-range, bistatic radar sensor operating at 122 GHz is presented. The goal is to show the feasibility of a SiP solution in a low-cost Surface-Mounted-Device (SMD) package. The millimeter-wave integrated circuit is based on a SiGe-BiCMOS technology which offers an fT of 280 GHz and fmax of 300 GHz. The setup of the radar sensor is introduced and measurement results for frequency-modulated-continuous-wave (FMCW) modulation demonstrate the performance of the radar front end. The targeted application areas are short range distance and speed measurements, which especially gain an advantage for high resolution distance measurements because of the short wavelength at mm-wave frequency. The chip occupies an area of 940 μm × 1450 μm, and dissipates a DC power of 450 mW.