Effect of low-temperature processing on dry film photoresist properties for flexible electronics
Effect of low-temperature processing on dry film photoresist properties for flexible electronics
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DOI：
10.1002/polb.23240
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发表时间：
2013-04-15
影响因子：
--
通讯作者：
de Rooij, Nico F.
中科院分区：
文献类型：
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作者：
Quintero, Andres Vasquez;Briand, Danick;de Rooij, Nico F.
本研究介绍了干膜光致抗蚀剂PerMX的机械特性及其层压到Kapton（R）E（PI）和Melinex（R）ST 506（PET）上时的粘合性能。此外，还对加工温度、粘接强度和中性面位置进行了研究和优化。开发了一种相对低温（85 ℃）的工艺，以保护具有低玻璃化转变温度的聚合物的完整性，并降低热失配应力。加工温度的降低导致粘合强度的降低。为了抵消这种不必要的影响，在层压之前在聚合物表面上进行表面处理（氧等离子体）。使用后一种技术，PerMX对PET的粘附力（硬烘烤：在85 ℃下1小时）从0.07 N mm-1增加到0.26 N mm-1（变化270%）。最后，在50，000次弯曲循环和2.5 mm的曲率半径之后，研究并通过调整中性平面的位置来增加机械鲁棒性。聚合物科学杂志B部分：聚合物物理学，2013
This study presents the mechanical characterization of the dry film photoresist PerMX and its adhesion properties when laminated onto Kapton (R) E (PI) and Melinex (R) ST506 (PET). Additionally, the processing temperature, the adhesion strength, and the neutral plane position are investigated and optimized. A relatively low-temperature (85 degrees C) process is developed to protect the integrity of the polymers with low glass transition temperature and reduce the thermal mismatch stress. Reduction in processing temperature led to a decrement in the adhesion strength. To counteract this unwanted effect, surface treatments (oxygen plasma) are performed on the polymer surface before lamination. Using the latter techniques, adhesion of PerMX to PET (hard bake: 1 h at 85 degrees C) is increased from 0.07 to 0.26 N mm1 (variation of 270%). Finally, the mechanical robustness is investigated and increased by tuning the position of the neutral plane, after 50,000 bending cycles and a radius of curvature of 2.5 mm. (c) 2013 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2013