Modeling and prediction of surface roughness in ceramic grinding
Modeling and prediction of surface roughness in ceramic grinding
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DOI：
10.1016/j.ijmachtools.2010.08.009
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发表时间：
2010-12-01
影响因子：
14
通讯作者：
Rao, P. Venkateswara
中科院分区：
文献类型：
--
作者：
Agarwal, Sanjay;Rao, P. Venkateswara
陶瓷磨削期间工件的表面质量在当今的行业中是一个不断增加的关注点。每个行业都在乎生产具有更好表面饰面的产品。产品表面饰面的重要性取决于其功能要求。由于表面饰面受许多因素支配，因此其实验性确定是费力且耗时的。因此，建立一个可靠的表面粗糙度预测模型仍然是陶瓷研磨的关键问题。在这项研究中，基于磨削过程的随机性质开发了一个新的分析表面粗糙度模型，该模型主要由随机几何形状和具有随机晶粒突出高度的车轮表面上的切割边缘的随机分布。获得了表面粗糙度与芯片厚度之间的简单关系，这通过碳化硅研磨的实验结果验证。 （c）2010 Elsevier Ltd.保留所有权利。
Surface quality of workpiece during ceramic grinding is an ever-increasing concern in industries now-a-days. Every industry cares to produce products with supposedly better surface finish. The importance of the surface finish of a product depends upon its functional requirements. Since surface finish is governed by many factors, its experimental determination is laborious and time consuming. So the establishment of a model for the reliable prediction of surface roughness is still a key issue for ceramic grinding. In this study, a new analytical surface roughness model is developed on the basis of stochastic nature of the grinding process, governed mainly by the random geometry and the random distribution of cutting edges on the wheel surface having random grain protrusion heights. A simple relationship between the surface roughness and the chip thickness was obtained, which was validated by the experimental results of silicon carbide grinding. (C) 2010 Elsevier Ltd. All rights reserved.