Fabrication of Responsive, Softening Neural Interfaces
Fabrication of Responsive, Softening Neural Interfaces
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DOI：
10.1002/adfm.201200200
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发表时间：
2012-08-21
影响因子：
19
通讯作者：
Voit, Walter
中科院分区：
文献类型：
--
作者：
Ware, Taylor;Simon, Dustin;Voit, Walter
本发明描述了一种使用光刻法在形状记忆聚合物衬底上图案化薄膜柔性电子器件的新颖处理方法，所述形状记忆聚合物衬底具有定制的机械性能以改善生物相容性并增强聚合物衬底与金属层之间的粘附性。标准的半导体晶片处理技术适于实现在具有可调模量的各种软化衬底上的稳健器件设计。所得器械足够坚硬（剪切模量类似于700 MPa），有助于器械植入，然后在体内软化（类似于300 kPa），在24 h内接近脑组织的模量（类似于10 kPa）。急性体内研究表明，这些材料能够记录神经活动。软化多电极阵列提供了高度可定制的接口，可以对其进行优化以提高生物相容性，从而为神经工程和神经科学开发出强大、可靠的神经电极。
A novel processing method is described using photolithography to pattern thin-film flexible electronics on shape memory polymer substrates with mechanical properties tailored to improve biocompatability and enhance adhesion between the polymer substrate and metal layers. Standard semiconductor wafer processing techniques are adapted to enable robust device design onto a variety of softening substrates with tunable moduli. The resulting devices are stiff enough (shear modulus of similar to 700 MPa) to assist with device implantation and then soften in vivo (similar to 300 kPa) approaching the modulus of brain tissue (similar to 10 kPa) within 24 h. Acute in vivo studies demonstrate that these materials are capable of recording neural activity. Softening multi-electrode arrays offer a highly customizable interface, which can be optimized to improve biocompatibility, enabling the development of robust, reliable neural electrodes for neural engineering and neuroscience.