Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy
Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy
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DOI：
10.1016/j.matdes.2015.05.077
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发表时间：
2015-10
影响因子：
8.4
通讯作者：
M. Salleh;S. McDonald;Y. Terada;H. Yasuda;K. Nogita
中科院分区：
文献类型：
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作者：
M. Salleh;S. McDonald;Y. Terada;H. Yasuda;K. Nogita
采用纳米陶瓷颗粒增强无铅焊料是一种很有前途的提高无铅焊料力学性能和热性能的方法。此外，先进的制造工艺路线，如微波烧结粉末冶金（PM），提高了复合焊料制造的性能。为了阐明机械和热性能改善的机制，Sn-Cu-Ni与TiO 2纳米复合添加剂，通过微波烧结PM方法制造，使用最先进的表征技术进行了研究。同步加速器微X射线荧光（XRF）的结果检测到微量钛的焊料基质。这与X射线光电子能谱（XPS）和高分辨率透射电子显微镜（HRTEM）的结果一致，表明纳米晶体在Sn基质中。这些纳米晶的形成可能是由于在快速高能微波加热过程中Ti的迁移。根据实验结果，提出了纳米复合钎料的热性能和机械性能得到改善的假设，并讨论了微波烧结粉末冶金工艺作为下一代无铅钎料加工的一种有前途的方法。
The use of reinforcing nano-size ceramic particulates is a promising method to improve the mechanical and thermal properties of lead-free solder materials. In addition, advanced fabrication processes routes such as microwave sintering powder metallurgy (PM) enhance properties in the fabrication of composite solders. To elucidate the mechanisms underlying the improvements in mechanical and thermal properties, Sn–Cu–Ni with TiO2nano-composite additions, fabricated via a microwave sintering PM method, were investigated using state-of-the-art characterization techniques. Synchrotron micro-X-ray fluorescence (XRF) results detected trace Ti in the solder matrix. This was consistent with X-ray photoelectron spectroscopy (XPS) and high resolution transmission electron microscopy (HRTEM) results which indicated that nano crystals were within the Sn matrix. It is possible these nano crystal form due to the migration of Ti during the rapid high energy microwave heating. A hypothesis of improved thermal and mechanical properties of nano-composite solders is discussed based on the results and the microwave sintering PM route was discussed as a promising method for next generation lead-free solder processing.