Next generation eWLB (embedded wafer level BGA) packaging
Next generation eWLB (embedded wafer level BGA) packaging
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下一代 eWLB（嵌入式晶圆级 BGA）封装
DOI：
10.1109/eptc.2010.5702695
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发表时间：
2010
期刊：
影响因子：
--
通讯作者：
A. Bahr
中科院分区：
文献类型：
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作者：
Yonggang Jin;X. Baraton;S. Yoon;Yaojian Lin;P. Marimuthu;V. Ganesh;T. Meyer;A. Bahr
晶圆级封装（WLP）的需求是由于需要缩小封装尺寸和高度，简化供应链，并通过使用批处理的基础设施提供更低的总成本。“扇入”(FI)-WLP通常有小于6x6mm的限制，以便通过板级可靠性要求，如跌落测试和温度循环，这是由于Si材料属性与PCB不匹配造成的。然而，“扇出”(FO)-WLP已经被开发并投入生产，通过将封装尺寸扩展到芯片面积之外，可以实现更高的球数WLP。FO-WLP最突出的类型是eWLB技术（嵌入式晶圆级球栅阵列）。目前业界已经有了第一代eWLB技术。本文将重点介绍下一代eWLB技术的一些最新进展，包括多rdl、薄eWLB和超大eWLB以及双面垂直互连。这些新一代eWLB的关键技术可以实现SoW （SiP on Wafer）和3D SiP等3D eWLB应用。3D eWLB可以通过硅通孔（TSV）应用以及离散组件嵌入来实现。将讨论下一代eWLB制造、组装和封装的工艺流程挑战。本文还将介绍在封装可靠性、力学特性和性能方面取得的一些成果。
Demand for wafer level packaging (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. “Fan-in” (FI)-WLP typically has a limitation to be less than 6x6mm in order to pass board level reliability requirements such as drop test and temperature cycle due to the mismatch of Si material properties to the PCB. However, the “Fan-out” (FO)-WLP, has been developed and introduced into production to allow for higher ball count WLP, by extending the package size beyond the area of the chip. The most prominent type of FO-WLP is the eWLB technology (embedded Wafer Level Ball Grid Array). Currently 1st generation eWLB technology is available in the industry. This paper will highlight some of the recent advancements in next generation eWLB technologies including multi-RDL, thin eWLB and extra large eWLB as well as double-side with vertical interconnection. These key technologies of next generation eWLB enable 3D eWLB applications such as SoW (SiP on Wafer) and 3D SiP. 3D eWLB can be implemented with through silicon via (TSV) applications as well as discrete component embedding. The process flow of next generation eWLB fabrication, assembly and packaging challenges will be discussed. This paper will also present some of the achievements in package reliability, mechanical characterization and performance.