CORRIGENDUM: A physical model to predict stiction in MEMS
CORRIGENDUM: A physical model to predict stiction in MEMS
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勘误表：预测 MEMS 中粘连的物理模型
DOI：
10.1088/0960-1317/12/5/329
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发表时间：
2006
期刊：
影响因子：
--
通讯作者：
I. Dewolf
中科院分区：
文献类型：
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作者：
W. V. Spengen;R. Pures;I. Dewolf
在微机电系统（mems）中，最重要的可靠性问题之一是粘性，即接触面由于表面力而产生的粘附性。在回顾了已知的物理理论和通常用于研究粘性的测量方法之后，我们提出了一个可以用于研究MEMS对粘性灵敏度的模型。它定量地预测了接触表面的表面相互作用能。模型中包括接触面的粗糙度和环境条件（湿度和温度）。这是通过将表面相互作用能描述为表面之间距离的函数来实现的。这个距离不是一个唯一的数字，而是距离的分布。结果表明，如果我们知道这种分布，就可以计算出表面相互作用能。该模型适用于毛细管凝聚力和分子相互作用力的预测。
One of the most important reliability problems in micro-electromechanical systems (MEMSs) is stiction, the adhesion of contacting surfaces due to surface forces. After reviewing the known physical theory, and the measurement method commonly used to investigate stiction, we present a model that can be used to investigate the sensitivity of MEMS to stiction. It quantitatively predicts the surface interaction energy of surfaces in contact. Included in the model is the roughness of the contacting surfaces and the environmental conditions (humidity and temperature). This is done by describing the surface interaction energy as a function of the distance between the surfaces. This distance is not a unique number, but rather a distribution of distances. It is shown that, if we know this distribution, we can calculate the surface interaction energy. The model is suitable for the prediction of forces due to capillary condensation and molecular interactions.