Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging
Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging
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DOI：
10.1016/j.jallcom.2016.07.084
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发表时间：
2016-12-15
影响因子：
6.2
通讯作者：
He, Peng
中科院分区：
文献类型：
--
作者：
Wang, Fengjiang;Zhou, Lili;He, Peng
为了改善Sn-58 Bi/Cu接头的界面组织和力学性能，在Cu基体中加入微量Zn元素。研究了等温液相和固相时效对Sn-58 Bi/Cu和Sn-58 Bi/Cu-2.29Zn界面金属间化合物（IMC）生长和弯曲性能的影响。液相时效对界面IMC的成分、厚度和形貌无明显影响，但等温固相时效抑制了Sn-58 Bi钎料/Cu界面IMC的生长，避免了界面上Cu 3Sn IMC、Kirkendall空洞和Bi偏析的形成。Cu-Zn基体也提高了接头的强度和断裂行为。Cu-Zn接头的弯曲断裂主要发生在钎料基体中，断裂方式为韧性断裂或沿着钎料/IMC界面断裂，断裂方式为部分脆性断裂;而Sn-Bi/Cu接头的弯曲断裂主要发生在界面处，断裂方式为沿着IMC/Cu界面断裂。(C)© 2016 Elsevier B. V.版权所有。
To improve the interfacial microstructure and mechanical behaviors of Sn-58Bi/Cu joint, minor Zn element was alloyed into Cu substrate. The interfacial intermetallic compound (IMC) growth and bending properties of Sn-58Bi/Cu and Sn-58Bi/Cu-2.29Zn were studied with the effect of isothermal liquid and solid aging. Although there was no significant change on the composition, thickness and morphology of interfacial IMC under liquid aging, the depressing of IMC growth at the interface between Sn-58Bi solder and substrate and the avoidance on formation of Cu3Sn IMC, Kirkendall voids and Bi segregation at the IMC/Cu interface were realized with Cu-Zn substrate under isothermal solid aging. Joint strength and fracture behavior were also improved by Cu-Zn substrate. There was no obvious decreasing on the joint strength and the fracture during bending was mainly occurred in the solder matrix with ductile fracture mode or along the solder/IMC interface with partly brittle fracture mode for Cu-Zn joint compared with the dramatically decreasing on joint strength and brittle fracture mode occurred along the interface between IMC and Cu for Sn-Bi/Cu joints after aging. (C) 2016 Elsevier B.V. All rights reserved.